SOT886
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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RFID IC, 860 MHz to 960 MHz, Read, Write, 128bit, Gen2 Tag, UCODE7m, XSON-6
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5422
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Buffers & Line Drivers BUS BUFFER/LINE DRIVER; 3-S
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 520000
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CMOS-Log Bus buffer gate with 3-state output SOT886 57 Log14 9z Nxp
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 65200
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CMOS-Log Bus buffer gate with 3-state output SOT886 57 Log14 9z Nxp
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 65200
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Low capacitance unidirectional fivefold ESD protection diode arrays
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 27172
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Analog Switch ICs LO-OHMIC SINGLE POLE-THROW ANALOG SW
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 520000
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Analogue Switch, 1 Channels, SPDT, 3.7 ohm, 1.4V to 4.3V, XSON, 6 Pins
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 520000
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TinyLogic ULP-A 2-Input NAND Gate; Package: MicroPak; No of Pins: 6; Container: Tape & Reel,Gates (AND / NAND / OR / NOR) 2-Input NAND Gate
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 7303
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DC/DC SWITCHING REGULATORS, LOW-VOLTAGE LDOS, MID-VOLTAGE LDOS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 30
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Single and dual-channel passive filter network with ESD protection
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 36666
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SOT886 2.2 V 1575.42MHz SiGe:C Low Noise Amplifier MMIC - XSON-6
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 60096
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The best reception of GNSS signals with the smallest footprint
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 11
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RF Amplifier, 40MHz to 6GHz, 22.5dB Gain, 0.6dB Noise, 2.2V to 2.85V, XSON-6
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 60000
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Hex Buffers And Line Drivers With 3-State Outputs 16-SOIC -40 to 85
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 30000
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Dual non-inverting Schmitt-trigger with 5 V tolerant input
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 512
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Hex Buffers And Line Drivers With 3-State Outputs 16-SO -40 to 85
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 7321
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Quadruple 2-Input Positive-OR Gates 14-TSSOP -40 to 85
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2579
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Quadruple 2-Input Positive-OR Gates 14-TSSOP -40 to 85
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 65200
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Triple 3-Input Positive-NOR Gates 14-SO -40 to 85
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 11924
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Single D-type flip-flop; positive-edge trigger
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 21256
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2-channel analog multiplexer/demultiplexer; Package: SOT886 (XSON6); Container: Tape reel smd,Encoders,Decoders,Multiplexers & Demultiplexers 3.3V 2-CH ANALOG
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 45000
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Quadruple 2-Line To 1-Line Data Selectors/Multiplexers With 3-State Outputs 16-TSSOP -40 to 85
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 7040
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Voltage Level Translator 1-CH Bidirectional 6-Pin XSON T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
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Voltage Level Translator 1-CH Bidirectional 6-Pin XSON T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3600
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Inverter, 74AUP2G04, 1 Input, 4mA, 0.8V to 3.6V, SOT886-6
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6328
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Q:What defines the physical structure of SOT886?
A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad: ~60% coverage for efficient heat dissipation.
- 6-pin layout with dual-row arrangement: Optimizes space and signal routing.
- 0.5 mm ultra-thin profile: Ideal for low-profile applications. -
Q:Why choose SOT886 over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller than SOT23-6.
- Thermal Performance: Direct PCB heat path reduces junction temperature by ~15%.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 rating). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 1.0×1.45 mm
- Height: 0.5 mm
- Pin Pitch: 0.35 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating.
- Temp Range: -40°C to +125°C. -
Q:Where is SOT886 typically applied?
A:Dominant use cases:
- Power Converters: Buck/boost ICs (e.g., TPS62743).
- RF Modules: Bluetooth/Wi-Fi FEMs (e.g., SKY66112).
- Sensor Interfaces: MEMS sensors (e.g., BME280). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal vias under pad (0.3 mm diameter).
- Solder Paste: Type 4 solder (particle size 20–38 μm).
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory due to hidden solder joints.



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