ALL CATEGORIESSOP 20
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8000
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 760
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5550
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Industrial components
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1190
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Multiple voltage regulator with switch and ignition buffer
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4000
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Ic translator triple 20-soic
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9341
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Bus XCVR Single 8-CH 3-ST 20-Pin SOIC W T/R
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1 + 10 + 25 + 50 + >=100 -
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Replaced by SN74ABT574A : Octal Edge-Triggered D-Type Flip-Flops With 3-State Outputs 20-SOIC -40 to 85
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1 + 10 + 25 + 50 + >=100 -
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64 KEYS ENCODER
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1930
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Motorola Semiconductor
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 804
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8000
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Samsung Semiconductor, Inc.
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2357
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Infineon Technologies Corporation
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1600
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1950
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10-Bit A/D Converter with Serial Interface - CMOS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8000
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
1
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10-Bit A/D Converter with Serial Interface
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 310
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Ic driver h-bridge 20-hsop
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3800
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2000
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4500
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
1
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
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12-BIT SHIFT REGISTER WITH OUTPUT LATCH
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1886
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 980
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1999
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4-BIT CISC SINGLE-CHIP MICROCOMPUTER 4500 SERIES
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 260
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VOICE COIL MOTOR DRIVER,Motor / Motion Controllers & Drivers DISC BY STM 11/99
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 790
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5556
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 100000
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 15000
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Octal D-type Flip-Flops (with 3-state outputs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1743
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Octal Buffers/Line Drivers (with 3-state outputs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6000
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Other Components
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 35
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PCM-RF SIGNAL PROCESSING
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4000
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
1
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1-LINE TO 8-LINE CLOCK DRIVER
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1 + 10 + 25 + 50 + >=100 -
1
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 600
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FET BIAS CONTROLLER AND TONE DETECTION
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 15000
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2100
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
1
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Gain Programmable CATV Line Driver
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1951
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IC LOGIC 573T OCTAL TRANSPARENT LATCH 5V -40+85C SOIC-20 37/TUBE
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
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10-bit serial-in parallel-out shift register
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1069
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Buffer/Line Driver 8-CH Inverting 3-ST BiCMOS 20-Pin SO
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1160
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Q:What defines the physical structure of SOP-20?
A:Key features include:
- 20-pin layout with dual-row gull-wing leads for surface mounting.
- Standardized body size: 12.8 mm × 7.5 mm (typical).
- Lead pitch: 1.27 mm for reliable solder joint formation.
- Thin profile: 2.65 mm height, suitable for space-constrained designs. -
Q:Why choose SOP-20 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller footprint than DIP-20, enabling high-density PCB layouts.
- Thermal Performance: Exposed die pad (optional) for direct PCB heat dissipation.
- Electrical Benefits: Low-inductance lead frame design for stable high-frequency signals.
- Reliability: Moisture-resistant (MSL3) epoxy molding compound. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 12.8 mm × 7.5 mm.
- Height: 2.65 mm.
- Pin Pitch: 1.27 mm.
- Material: Copper-alloy leads with matte tin plating.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is SOP-20 typically applied?
A:Dominant use cases:
- Power Management: DC-DC converters (e.g., TI TPS5430).
- Communication: RS-485 transceivers (e.g., Maxim MAX485).
- Embedded Systems: Microcontroller interfaces (e.g., STM32 series). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Thermal relief pads for leads; avoid sharp trace angles.
- Solder Paste: Type 3 (particle size 25–45 µm) for precise deposition.
- Reflow Profile: Peak temperature ≤ 250°C (SnAgCu alloy).
- Inspection: Optical/AXI for lead coplanarity and solder voids.