SOIC 28
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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IC TELEPHONE CMOS MULTIFU 28SOIC HT SUSA CODE:8542399000
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1594
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IC TELEPHONE CMOS MULTIFU 28SOIC HT SUSA CODE:8542399000
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 766
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IC TELEPHONE CMOS MULTIFU 28SOIC HT SUSA CODE:8542399000
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 570
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IC TELEPHONE CMOS MULTIFU 28SOIC HT SUSA CODE:8542399000
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1778
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IC TELEPHONE CMOS MULTIFU 28SOIC HT SUSA CODE:8542399000
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1633
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IC TELEPHONE CMOS MULTIFU 28SOIC HT SUSA CODE:8542399000
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 395
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CMOS ASYNCHRONOUS FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3500
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CMOS ASYNCHRONOUS FIFO 2048 x 9, 4096 x 9, 8192 x 9 and 16384 x 9
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 40
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Solid State Relays 10-pole, extra logic, MLP LCAS, T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5000
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Solid State Relays 10-pole, extra logic, MLP LCAS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 202
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Solid State Relays - PCB Mount 10-pole, no SCR, MLP LCAS, T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 16500
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Solid State Relays - PCB Mount 10-pole, no SCR, MLP LCAS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 16500
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Solid State Relays - PCB Mount 10-pole MLP LCAS, T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 16500
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Solid State Relays - PCB Mount 10-pole MLP LCAS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 16500
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Solid State Relays 10-pole, extra logic, SOIC LCAS, T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
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Solid State Relays 10-pole, extra logic, SOIC LCAS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4580
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Solid State Relays 10-pole, no SCR, SOIC LCAS, T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 19180
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Solid State Relays - PCB Mount 10-pole SOIC LCAS, T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 829
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Solid State Relays - PCB Mount 10-pole, no SCR, extra logic, MLP LCAS, T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 16500
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Solid State Relays 10-pole, no SCR, extra logic, MLP LCAS
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4500
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Solid State Relays - PCB Mount 10-pole, extra logic, MLP LCAS, T/R
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 16500
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Solid State Relays 10-pole, extra logic, MLP LCAS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 290
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Solid State Relays - PCB Mount 10-pole MLP LCAS, T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 16500
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Line Card Access Switch,Solid State Relays 10-pole, extra logic, SOIC LCAS, T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3600
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Line Card Access Switch,Solid State Relays 10-pole, extra logic, SOIC LCAS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8540
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Solid State Relays - PCB Mount 10-pole, no SCR, SOIC LCAS, T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 16500
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Line Card Access Switch,Solid State Relays 10-pole, no SCR, SOIC LCAS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4580
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Line Card Access Switch,Solid State Relays 10-pole SOIC LCAS, T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2015
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Line Card Access Switch,Solid State Relays 10-pole SOIC LCAS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 110
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IC FIFO 4096X18 50NS 32PLCC; HT SUSA CODE:8542320070
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9961
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IC MEM FIFO 2048X9 20NS 32-PLCC; HT SUSA CODE:8542320070
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9727
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FIFO Mem Async Dual Depth/Width Uni-Dir 1K x 9 32-Pin PLCC Tube
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9633
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Q:What defines the physical structure of SOIC-28?
A:Key features include:
- Gull-wing leads: Symmetrical outward-bent pins for reliable PCB mounting.
- Standardized footprint: 28-pin layout with dual-inline (DIP) arrangement.
- Compact body: 17.9×7.5 mm outline for space-constrained designs.
- Low profile: 2.65 mm typical height for slim applications. -
Q:Why choose SOIC-28 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller than DIP-28 while maintaining pin compatibility.
- Thermal Performance: Exposed die pad (5×5 mm coverage) for enhanced heat dissipation.
- Electrical Benefits: Short lead lengths reduce inductance (<1 nH typical).
- Reliability: JEDEC MS-013-compliant mold compound for moisture resistance. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 17.9×7.5 mm (nominal).
- Height: 2.65 mm (max).
- Pin Pitch: 1.27 mm (50 mil).
- Material: Copper-alloy leads with Sn/Pb or lead-free plating.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is SOIC-28 typically applied?
A:Dominant use cases:
- Industrial MCUs: e.g., STM32F4 series.
- Power Management ICs: e.g., TI TPS7A4700 LDO regulators.
- Communication Interfaces: e.g., Maxim MAX485 RS-485 transceivers. -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 0.2 mm solder mask clearance around pads.
- Solder Paste: Type 3 (particle size 25–45 μm) for fine-pitch printing.
- Reflow Profile: Peak temperature ≤ 260°C (lead-free) with 60–90 sec above 217°C.
- Inspection: AOI (Automated Optical Inspection) for lead coplanarity checks.



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