SOD-70
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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Silicon temperature sensors,Board Mount Temperature Sensors SENSOR TEMP BULK
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4000
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Temperature Sensor IC, -55 °C, 150 °C, SOD-70, 2 Pins
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5900
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Board Mount Temperature Sensors SENSOR TEMP BULK
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5000
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Silicon temperature sensors; Package: SOD70 (PBCYT2); Container: Bulk pack,Board Mount Temperature Sensors TEMP SENSOR BULK
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 520000
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Board Mount Temperature Sensors TEMP SENSOR BULK
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 13689
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Silicon temperature sensors; Package: SOD70 (PBCYT2); Container: Bulk pack,Board Mount Temperature Sensors SENSOR TEMP BULK
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 520000
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KTY81 Series 3.6 V - 55 C to + 150 C Silicon Temperature Sensor - SOD-70-2
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 520000
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Temperature Sensor IC, Analogue, ± 2.5°C to ± 5°C, -55 °C, +150 °C, SOD-70, 2 Pins
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 215327
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Temperature Sensor IC, Analogue, -55 °C, 150 °C, SOD-70, 2 Pins
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 520000
-
-
Temperature Sensor IC, -55 °C, 150 °C, SOD-70, 2 Pins
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 520000
-
-
Silicon temperature sensors; Package: SOD70 (PBCYT2); Container: Bulk pack,Board Mount Temperature Sensors SENSOR TEMP BULK
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 520000
-
-
Board Mount Temperature Sensors SENSOR TEMP BULK
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 114340
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KTY81 Series 10 mA 1020 O Silicon Temperature Sensor Through Hole - SOD-70
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2510
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Board Mount Temperature Sensors SENSOR TEMP BULK
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 63400
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Q:What defines the physical structure of SOD-70?
A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad (80% coverage): Enhances heat dissipation.
- 2-pin layout with symmetric alignment: Simplifies circuit design.
- 1.0 mm ultra-thin profile: Ideal for space-constrained applications. -
Q:Why choose SOD-70 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller than SOD-123 packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 15%.
- Electrical Benefits: Low-inductance design (<1 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 compliant). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 3.5 × 1.6 mm
- Height: 1.0 mm
- Pin Pitch: 1.2 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C -
Q:Where is SOD-70 typically applied?
A:Dominant use cases:
- Power Converters: Buck/boost circuits (e.g., TI TPS62130).
- RF Modules: Antenna matching networks (e.g., Skyworks SKY67150).
- Sensor Interfaces: IoT devices (e.g., Bosch BME280). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Use thermal vias under the central pad (≥4 vias, 0.3 mm diameter).
- Solder Paste: Type 4 solder recommended for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<10% tolerance).



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