ALL CATEGORIESSMT-2
- Picture & Models
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Photodiode PIN Chip 940nm Automotive 2-Pin SMD T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10000
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Phototransistor IR Chip Silicon 950nm 2Pin SMD T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2185
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Optical Sensor (Photodetector - NPN) Phototransistor; Package/Case:TO-5; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No; C-E Breakdown Voltage:70V; Collector Current:0.05A; Dark Current:200nA; Light Current:7.0mA RoHS Compliant: Y,Photodetector Transistors 5V 100mW 880nm
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9989
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Optical Sensor (Photodetector - NPN) Phototransistor; Package/Case:TO-5; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No; C-E Breakdown Voltage:70V; Collector Current:0.05A; Dark Current:200nA; Light Current:7.0mA RoHS Compliant: Y,Transistor Output Optocouplers NPN Phototransistor
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2000
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Silicon Phototransistor (detector applications NPN epitaxial planar phototransistor)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 18000
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IR-Lumineszenzdiode (940 nm) mit hoher Ausgangsleistung
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1850
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Optoelectronics
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 50000
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Emitters and Detectors for Infrared (IR) Touchscreens
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3980
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Optoelectronics
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 13850
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Optoelectronics
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 36850
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Optoelectronics
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 16000
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SMD LED
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 100000
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InGaP HBT Active Bias Gain Block
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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PHOTOTRANS SIDE VIEW SMD T/R
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1 + 10 + 25 + 50 + >=100 -
1
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Optoelectronics
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 54344
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RIGHT ANGLE SURFACE MOUNT INFRARED PHOTOTRANSISTOR
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 22000
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EMITTER DUAL 660/905NM CERAMIC
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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PHOTODIODE LENSED 0.4X0.4MM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8000
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Plastic Photodiode Packages with Leads
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 12000
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N/A
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 50000
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Double-end type high-sensitivity photo diode mounted in a compact clear package
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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Aluminum Electrolytic Capacitors - SMD 100uF 35 Volts 0.2
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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Other Components
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 14000
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Q:What defines the physical structure of SMT-2?
A:Key features include:
- Leadless bottom-mounted pads for compact PCB attachment.
- Central thermal pad (80% coverage) for enhanced heat dissipation.
- 16-pin layout with dual-row perimeter arrangement.
- 0.8 mm ultra-thin profile for space-constrained designs. -
Q:Why choose SMT-2 over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller than SOP-8 packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 25%.
- Electrical Benefits: Low-inductance design (<1 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL-3 certified). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 3.0 × 3.0 mm
- Height: 0.8 mm
- Pin Pitch: 0.5 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C -
Q:Where is SMT-2 typically applied?
A:Dominant use cases:
- Power Converters: e.g., Buck/boost ICs (e.g., TPS62130).
- RF Modules: e.g., Bluetooth/Wi-Fi transceivers (e.g., CC2652R).
- Sensor Interfaces: e.g., MEMS accelerometers (e.g., LIS2DH12). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal vias array under the central pad (0.3 mm diameter).
- Solder Paste: Type 4 solder (particle size 20–38 µm) recommended.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<15% tolerance).