SMD.LED

Q:What defines the physical structure of SMD.LED?

A:Key features include:
- Leadless design: Bottom-mounted pads for direct PCB attachment.
- Compact footprint: Standard sizes like 0603 (0.6 × 0.3 mm) or 2835 (2.8 × 3.5 mm).
- Integrated lens: Dome-shaped or flat silicone lens for light diffusion.
- Low profile: Typical height of 0.2–1.2 mm for space-constrained designs.

Q:Why choose SMD.LED over alternatives?

A:Critical advantages:
- Miniaturization: 50–70% smaller than traditional through-hole LEDs.
- Thermal Performance: Direct copper pad heat dissipation (e.g., 85% thermal efficiency).
- Electrical Benefits: Low forward voltage (e.g., 2.8–3.4V) and high luminous efficacy (e.g., 120 lm/W).
- Reliability: Moisture-resistant epoxy resin (JEDEC Level 2 compliant).

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 1.6 × 1.6 mm (e.g., 1616 package) to 5.0 × 5.0 mm (e.g., 5050).
- Height: 0.2–1.5 mm (varies by package).
- Wavelength: 450–660 nm (RGB/white options).
- Material: Aluminum or ceramic substrate with gold wire bonding.
- Temp Range: -40°C to +85°C (extended to +125°C for automotive).

Q:Where is SMD.LED typically applied?

A:Dominant use cases:
- Consumer Electronics: Backlighting (e.g., smartphones, TVs).
- Automotive: Dashboard indicators, taillights (e.g., Osram Duris S5).
- Industrial: UV curing, machine vision (e.g., Nichia NFSx363B).
- IoT Devices: Wearables, smart sensors (e.g., Cree XLamp XB-D).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: Use 1–2 oz copper pads with thermal vias for heat dissipation.
- Solder Paste: Type 3 or 4 (particle size 25–45 μm) for fine-pitch packages.
- Reflow Profile: Peak temp ≤ 260°C (Pb-free) with 30–60 sec above 217°C.
- Inspection: AOI (Automated Optical Inspection) for solder joint integrity.