SMA

Q:What defines the physical structure of SMA?

A:Key features include:
- Leadless bottom-mounted pads for compact PCB integration
- Central thermal pad (80% coverage) for enhanced heat dissipation
- 6-pin layout with symmetrical arrangement
- 1.0 mm ultra-thin profile for space-constrained designs

Q:Why choose SMA over alternatives?

A:Critical advantages:
- Miniaturization: 40% smaller than SOIC-8 packages
- Thermal Performance: Direct PCB heat path reduces junction temperature by 15°C
- Electrical Benefits: Low-inductance design (<0.5nH) for high-frequency applications
- Reliability: Moisture-resistant ceramic substrate (MSL-3 certified)

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 2.5×2.5 mm
- Height: 1.0 mm
- Pin Pitch: 0.65 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -55°C to +150°C

Q:Where is SMA typically applied?

A:Dominant use cases:
- RF/Microwave: Cellular PA modules (e.g., Qorvo QPA1012)
- Power Management: DC-DC converters (e.g., TI TPS62840)
- IoT Devices: Bluetooth/WiFi FEMs (e.g., Skyworks SKY66121)

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: Minimum 4 thermal vias under central pad (0.3mm diameter)
- Solder Paste: Type 4 solder with ≥88% metal content
- Reflow Profile: Peak temp ≤ 250°C (Pb-free process)
- Inspection: X-ray (AXI) required for joint integrity verification