ALL CATEGORIESSLP1616P6
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RailClamp® Low Capacitance TVS Array
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5655
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Low Voltage TVS for ESD Protection
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 86730
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SEMTECH RCLAMP3654PATCT TVS Diode, RailClamp Series, Unidirectional, 5.5V, 30V, SLP1616P6, 6Pins
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1354
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TVS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 15000
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TVS Diode Array Uni-Directional RCLAMP3654P.TCT Dual 30V, 350W, SLP EP 6-Pin
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 34314
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RailClamp® Low Capacitance TVS Array
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 27000
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Dual Uni-Directional TVS Diode Array, 200W, 6-Pin SLP EP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 15376
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RCLAMP0854P 4LINES 8V SLP ; HT SUSA CODE:8541100050
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2877
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RailClamp® Low Capacitance TVS Array
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 99000
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N/A
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10
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TVS Diode; Stand-Off Voltage, VRWM:5V; Breakdown Voltage, Vbr:6V; Capacitance, Cd:0.8pF; Package/Case:SLP1616P6; Breakdown Voltage Min:6V; Junction Capacitance:3pF; Leaded Process Compatible:Yes; Mounting Type:Surface Mount RoHS Compliant: Yes
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 40000
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USB Upstream Port Filter and TVS For EMI Filtering and ESD Protectio...
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 168000
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Q:What defines the physical structure of SLP1616P6?
A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad (80% coverage): Optimizes heat dissipation.
- 16-pin layout with dual-row perimeter arrangement: Balances I/O density and space efficiency.
- 0.8 mm ultra-thin profile: Ideal for low-profile applications. -
Q:Why choose SLP1616P6 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller than SOP-16 packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by ~15%.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 rated). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 1.6×1.6 mm
- Height: 0.8 mm
- Pin Pitch: 0.4 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C -
Q:Where is SLP1616P6 typically applied?
A:Dominant use cases:
- Power Converters: Buck/boost ICs (e.g., TPS62130).
- RF Modules: Bluetooth/Wi-Fi transceivers (e.g., CC2640).
- Sensor Interfaces: MEMS sensors (e.g., BME280). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal vias array under the central pad (0.3 mm diameter).
- Solder Paste: Type 4 solder (particle size 20–38 µm).
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for pad alignment verification.