ALL CATEGORIESSIP-11
- Picture & Models
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10
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BUF OR INV BASED PRPHL DRVR, PSFM11
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 56
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Discrete Semiconductors
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1 + 10 + 25 + 50 + >=100 -
1
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Motor / Motion / Ignition Controllers & Drivers DC BRUSH MOTOR DRIVER
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 110
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CONV DC-DC 5V IN 1.8V OUT 5.4W
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 150
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Transistors
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 57
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 120
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Discrete Semiconductors
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 208
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Other Components
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 25
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Linear Integrated Circuit Dual, 2.5W (7.8W BTL) Audio Amp
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 201
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Other Components
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 11
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Module
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 57
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 290
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Microprocessor Power Supply System
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1 + 10 + 25 + 50 + >=100 -
1
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National Semiconductor(TI)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3285
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National Semiconductor(TI)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10
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Monolithic Triple 3 ns CRT Driver
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1 + 10 + 25 + 50 + >=100 -
1
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National Semiconductor(TI)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 13
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Resistor Networks & Arrays
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 20000
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Resistor Networks & Arrays 100K OHM 11 PIN 2% LOW C-SIP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 20000
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Resistor Networks & Arrays 10K OHM 11 PIN 2% LOW C-SIP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 20000
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Other Components
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 299
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Other Components
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 102
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10.9 mm (0.43 inch) Seven Segment Displays,LED Displays Green 571nm 0.43in 7 Segment
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2400
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
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Other Components
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 24
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Improved Low Cost Triple CRT Driver
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 410
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High-power LED Drivers for Illumination; Input voltag (V): 113 to 170 (80 to 120V in AC conversion); Output voltage (V): 2.5 to 12; Output current (mAr): 250 to 350; Number of LEDs: 1 to 3; Package: SIP11;,LED Drivers High Power 113-170V 80-120V in AC conv.
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9000
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High-power LED Drivers for Illumination; Input voltag (V): 113 to 170 (80 to 120V in AC conversion); Output voltage (V): 2.5 to 4; Output current (mAr): 700 to 960; Number of LEDs: 1; Package: SIP11;,LCD Drivers High Power LED Drvr For 1 LED
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9000
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Isolated AC/DC Converter AC 100V to AC 220V input, 3.3V / 3A output
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 106
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Insulation Type AC-DC Converter AC 100V input, 12 V/1000 mA output
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 13390
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Isolated AC/DC Converters; Packing style: Tray; Package quantity: 96;
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 390
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ECONOLINE: RN - Custom Solutions Available- 1kVDC & 2kVDC Isolation- No Extern. Components Required- UL94V-0 Package Material- No Heatsink Required- Efficiency to 85%
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 30000
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18W Audio Power Amplifier Circuit
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 110
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10
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ROBUST ELECTRICAL SURGE IMMUNITY FOR POE PDS THROUGH INTEGRATED PROTECTION
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 695
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SIP Module: 5.0A Rated Switcher with 2.5V LDO, Pb-Free
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1 + 10 + 25 + 50 + >=100 -
1
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SIP Module: 5.0A Rated Switcher with 3.3V LDO, Pb-Free
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1 + 10 + 25 + 50 + >=100 -
1
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1025
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IGBT Module U-Series
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6535
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Module
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 55
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National Semiconductor(TI)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 150
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Resistor Networks & Arrays 14pins 820Kohms Bussed
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 20000
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Resistor Networks & Arrays 14pins 82Kohms Bussed
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 20000
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Resistor Networks & Arrays 14pins 8.2Kohms Bussed
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 20000
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Resistor Networks & Arrays 14pins 820ohms Bussed
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 20000
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Resistor Networks & Arrays 14pins 82ohms Bussed
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 20000
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Resistor Networks & Arrays 14pins 680Kohms Bussed
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 20000
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Resistor Networks & Arrays 14pins 68Kohms Bussed
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 20000
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Resistor Networks & Arrays 14pins 6.8Kohms Bussed
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 20000
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Q:What defines the physical structure of SIP-11?
A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad (80% coverage): Optimizes heat dissipation.
- 11-pin layout with dual-row arrangement: Balances pin density and space efficiency.
- 1.2 mm ultra-thin profile: Ideal for low-profile applications. -
Q:Why choose SIP-11 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller than traditional SIP-8 packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by up to 15%.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 certified). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 5.0 × 5.0 mm
- Height: 1.2 mm
- Pin Pitch: 0.65 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C -
Q:Where is SIP-11 typically applied?
A:Dominant use cases:
- Power Converters: e.g., Buck/boost ICs (e.g., TPS62130).
- RF Modules: e.g., Bluetooth/Wi-Fi transceivers (e.g., CC2640).
- Sensor Interfaces: e.g., MEMS pressure sensors (e.g., BMP280). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal vias array under central pad (0.3 mm diameter).
- Solder Paste: Type 4 solder recommended for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<15% tolerance).