SIP-10
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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±5V ±200mA 4.75V~5.25V 2W Buck-boost type DC-DC 72% SIP-10 Power Modules ROHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 7144
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TRANSISTOR | MOSFET | ARRAY | N-CHANNEL | 100V V(BR)DSS | 5A I(D) | SIP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 110
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TRANSISTOR | MOSFET | ARRAY | N-CHANNEL | 60V VBRDSS | 5A ID | SIP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 208
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TRANSISTOR | MOSFET | ARRAY | N-CHANNEL | 30V V(BR)DSS | 5A I(D) | SIP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 215
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TRANSISTOR | MOSFET | ARRAY | P-CHANNEL | 60V V(BR)DSS | 2A I(D) | SIP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 110
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NPN SILICON EPITAXIAL POWER TRANSISTOR ARRAY LOW SPEED SWITCHING(DARLINGTON)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 208
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NPN SILICON POWER TRANSISTOR ARRAY HIGH SPEED SWITCHING USE DARLINGTON TRANSISTOR INDUSTRIAL USE
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 310
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TRANSISTOR | BJT | ARRAY | DARLINGTON | 80V V(BR)CEO | 2A I(C) | SIP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 56800
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Resistor Networks & Arrays 100 5% OHM 56PF RES/CAP NETWO
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 20000
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Capacitor Arrays & Networks 10 PIN 1000 PF 10%
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 28000
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Q:What defines the physical structure of SIP-10?
A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad (80% coverage): Enhances heat dissipation.
- 10-pin layout with dual-row alignment: Optimizes space efficiency.
- 1.0 mm ultra-thin profile: Ideal for low-profile applications. -
Q:Why choose SIP-10 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller than SOP-8 packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 15%.
- Electrical Benefits: Low-inductance design (<1 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 rated). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 5.0 × 6.0 mm
- Height: 1.0 mm
- Pin Pitch: 0.5 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C -
Q:Where is SIP-10 typically applied?
A:Dominant use cases:
- Power Converters: Buck/boost ICs (e.g., TPS62130).
- RF Modules: Bluetooth/Wi-Fi transceivers (e.g., CC2650).
- Sensor Interfaces: MEMS pressure sensors (e.g., BMP280). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal vias under the central pad (0.3 mm diameter).
- Solder Paste: Type 4 solder (particle size 20–38 μm).
- Reflow Profile: Peak temp ≤ 245°C (60 sec above 217°C).
- Inspection: X-ray (AXI) mandatory for void detection (<15%).



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