SC-70
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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4A@8/20us 24V SC-70 Electrostatic and Surge Protection (TVS/ESD) ROHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4334
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20V 3.1A 80mΩ@4.5V,3.1A P Channel SC-70 MOSFETs ROHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6098
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ESD Suppressor TVS Bi-Dir 24V Automotive 3-Pin SC-70 T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9562
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MCU 8-bit 78K0 CISC 24KB Flash 2.5V/3.3V/5V Automotive 44-Pin LQFP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 20
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Analogue Switch, 1 Channels, SPDT, 15 ohm, -12V to -4V, SC-70, 6 Pins
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1557
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32-Bit Power Architecture SoC, 2 X 1067MHz, DDR1/2, AltiVec, GbE, PCI-e, SRIO, 0 to 105C, Rev 3
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 25
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TEXAS INSTRUMENTS INA214BIDCKT Current Sense Amplifier, 1 Amplifier, 28μA, SC-70, 6Pins, -40℃, 125℃
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1 + 10 + 25 + 50 + >=100 -
1
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TEXAS INSTRUMENTS INA213BIDCKT Current Sense Amplifier, 1 Amplifier, 28μA, SC-70, 6Pins, -40℃, 125℃
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1 + 10 + 25 + 50 + >=100 -
1
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26V, Bi-Directional, Zero-Drift, High Accuracy, Low-/High-Side, Voltage Out Current Shunt Monitor 6-SC70 -40℃ to 125℃
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1 + 10 + 25 + 50 + >=100 -
1
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RF Detector 300MHz to 7000MHz 12dBm 6Pin SC-70 T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 703
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300MHz to 7GHz RF Power Detector with Buffered Output in SC70 Package
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 604
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300MHz to 3GHz RF Power Detector in SC70 Package
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 656
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26V, Bi-Directional, Zero-Drift, Low- or High-Side, Voltage Output Current Shunt Monitor 6-SC70 -40℃ to 125℃
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1 + 10 + 25 + 50 + >=100 -
1
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LM5165 Low Iq Synchronous Buck Converter High Density COT Evaluation Module
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1 + 10 + 25 + 50 + >=100 -
1
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Bq28z610 EVM 1-Cell to 2-Cell Programmable Battery Manager Evaluation Module
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1 + 10 + 25 + 50 + >=100 -
1
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V-Ref Adjustable 0.2V to 18V 15mA 5-Pin SC-70 T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 7819
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Enhanced Product Dual Inverter Buffer/Driver With Open-Drain Output 6-SC70 -55 to 125,Buffers & Line Drivers Mil Enh Dual Invtr Bfr/Drvr
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1 + 10 + 25 + 50 + >=100 -
1
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Enhanced Product Single Positive-Edge-Triggered D-Type Flip-Flop 5-SC70 -55 to 115,Flip Flops Mil Enh Sgl Pos Edge-Trgrd D-Type
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1 + 10 + 25 + 50 + >=100 -
1
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Enhanced Product Single Bus Buffer Gate With 3-State Outputs 5-SC70 -55 to 125,Buffertar och linjedrivare Mil Enh Sgl Bus Bfr Gate
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1 + 10 + 25 + 50 + >=100 -
1
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Enhanced Product Single 2-Input Positive-Or Gate 5-SC70 -55 to 125,Gates (AND / NAND / OR / NOR) Mil Enh Sgl 2-Inp Pos-OR Gate
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1 + 10 + 25 + 50 + >=100 -
1
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Enhanced Product Single 2-Input Positive-Or Gate 5-SC70 -40 to 85,Gates (AND / NAND / OR / NOR) Mil Enh Sgl 2-Inp Pos-OR Gate
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1 + 10 + 25 + 50 + >=100 -
1
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Enhanced Product Single 2-Input Positive-And Gate 5-SC70 -40 to 85,Gates (AND / NAND / OR / NOR) Mil Enh Sgl 2-Inp Pos-AND Gate
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1 + 10 + 25 + 50 + >=100 -
1
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Enhanced Product Single 2-Input Positive-Nand Gate 5-SC70 -55 to 125,Gates (AND / NAND / OR / NOR) Mil Enh Sgl 2-Inp Pos-NAND Gate
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1 + 10 + 25 + 50 + >=100 -
1
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Enhanced Product Single 2-Input Positive-Nand Gate 5-SC70 -40 to 85,Gates (AND / NAND / OR / NOR) Mil Enh Sgl 2-Inp Pos-NAND Gate
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1 + 10 + 25 + 50 + >=100 -
1
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Enhanced Product Configurable Multiple-Function Gate 6-SC70 -40 to 85,Gates (AND / NAND / OR / NOR) Mil Enh Conf Mult Function Gate
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1 + 10 + 25 + 50 + >=100 -
1
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Composite Device - Transistors with built-in Resistor
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 69000
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Composite Device - Transistors with built-in Resistor
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6000
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Composite Device - Transistors with built-in Resistor
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 18000
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Q:What defines the physical structure of SC-70?
A:Key features include:
- Leadless bottom-mounted pads for compact PCB attachment.
- Central thermal pad (50% coverage) for improved heat dissipation.
- 6-pin layout with dual-row asymmetric arrangement.
- 1.0 mm ultra-thin profile for space-constrained designs. -
Q:Why choose SC-70 over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller than SOT-23 packages.
- Thermal Performance: Direct PCB heat path via exposed pad.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-frequency apps.
- Reliability: Moisture-resistant substrate (MSL3 rating). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 2.0 × 1.25 mm
- Height: 1.0 mm
- Pin Pitch: 0.65 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C -
Q:Where is SC-70 typically applied?
A:Dominant use cases:
- Portable Electronics: Power management ICs (e.g., TPS62260).
- RF Modules: Low-noise amplifiers (e.g., BGA2818).
- Sensor Interfaces: IoT devices (e.g., BME280). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Thermal vias under pad (4–6 vias recommended).
- Solder Paste: Type 4 solder (particle size 20–38 μm).
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for pad alignment.



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