QFP 64

Q:What defines the physical structure of QFP 64?

A:Key features include:
- Gull-wing leads: 64 outward-bent pins for surface mounting.
- Central thermal pad: Optional 4×4 mm pad for improved heat dissipation.
- High-density layout: 64-pin configuration with perimeter pin arrangement.
- Low profile: Standard thickness of 1.4 mm (varies by variant).

Q:Why choose QFP 64 over alternatives?

A:Critical advantages:
- Space efficiency: 30% smaller footprint than equivalent PLCC packages.
- Thermal Performance: Exposed pad (if present) reduces junction-to-PCB thermal resistance.
- Electrical Benefits: Short lead lengths minimize inductance for high-frequency signals.
- Reliability: Molded plastic body with moisture resistance (JEDEC Level 3).

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 10×10 mm (varies by manufacturer).
- Height: 1.4 mm (typical).
- Pin Pitch: 0.5 mm (standard; 0.4 mm for fine-pitch variants).
- Material: Copper-alloy leads with Sn/Pb or lead-free plating.
- Temp Range: -40°C to +125°C (industrial grade).

Q:Where is QFP 64 typically applied?

A:Dominant use cases:
- Microcontrollers: e.g., STM32F4 series (ARM Cortex-M).
- Communication ICs: e.g., Ethernet PHYs (DP83848).
- Industrial Control: Motor drivers and power management ICs.

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: Use 0.1 mm solder mask dams between pins to prevent bridging.
- Solder Paste: Type 4 (20–38 µm particle size) for fine-pitch reliability.
- Reflow Profile: Peak temperature ≤ 250°C (lead-free) with 60–90 sec above 217°C.
- Inspection: Automated Optical Inspection (AOI) mandatory for pin alignment.