QFN-6
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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RF Amplifier, PHEMT, 12 dB Gain / 7 dB Noise, DC to 10 GHz, 90 mA Supply, DFN-6
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1426
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RF Amp Single MMIC Amp 10GHz 7V 6-Pin DFN EP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 100
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600mA Driver Tr. Built-In, Synchronous Step-Down DC/DC Converters
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1007
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Single Output LDO, 250mA, Fixed (1.8V), Low Quiescent Current, Low Noise, High PSRR 6-SON -40 to 125,Low Dropout (LDO) Regulators Sgl Out,250mA,Fixed Lo Quies Crnt
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1 + 10 + 25 + 50 + >=100 -
1
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Conv DC-DC 2V to 6V Synchronous Step Down Single-Out 0.6V to 6V 0.6A 6-Pin WSON EP T/R
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1 + 10 + 25 + 50 + >=100 -
1
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2.25MHz, 1A Peak Current Limited Step-Down Converter 6-SON -40 to 85,Switching Converters, Regulators & Controllers 2.25MHz,1A Peak Crnt Ltd Step-Down Cnvtr
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1 + 10 + 25 + 50 + >=100 -
1
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5V, 400mA, 4MHz Step-Up DC/DC Converter 6-SON,Switching Converters, Regulators & Controllers 5V 400mA 4MHz Step- Up DC/DC Cnvrtr
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1 + 10 + 25 + 50 + >=100 -
1
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LED Driver with Digital and PWM Brightness Control
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 98650
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50 MHz to 400 MHz CASCADEABLE AMPLIFIER,Video Amplifiers 5 MHz to 400MHz Casadable Amp
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1 + 10 + 25 + 50 + >=100 -
1
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1.5A, 1.5 MHz Adjustable, with inhibit function Step-down switching regulator in DFN6 3x3
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 34381
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Q:What defines the physical structure of QFN-6?
A:Key features include:
- Leadless bottom-mounted pads for compact PCB attachment.
- Central thermal pad (~40% coverage) for enhanced heat dissipation.
- 6-pin layout with peripheral pad arrangement.
- Ultra-thin profile (0.5–0.9 mm typical height). -
Q:Why choose QFN-6 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller than SOIC-8, ideal for space-constrained designs.
- Thermal Performance: Direct PCB heat path via exposed thermal pad.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 rating). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 2.0 × 2.0 mm (varies by vendor).
- Height: 0.8 mm (typical).
- Pin Pitch: 0.5 mm.
- Material: Copper-alloy leads with Ni/Pd/Au plating.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is QFN-6 typically applied?
A:Dominant use cases:
- Portable Electronics: Power management ICs (e.g., TI TPS62743).
- IoT Sensors: Low-power MCUs (e.g., STM32L0 series).
- RF Modules: Bluetooth/Wi-Fi transceivers (e.g., nRF52840). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal vias under pad (0.3 mm diameter).
- Solder Paste: Type 4 (fine powder) for reliable reflow.
- Reflow Profile: Peak temp ≤ 250°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory due to hidden solder joints.



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