QFN-36

Q:What defines the physical structure of QFN-36?

A:Key features include:
- Leadless bottom-mounted pads for direct PCB attachment.
- Central thermal pad (70% coverage of package base) for enhanced heat dissipation.
- 36-pin layout with perimeter-only or dual-row pin arrangement.
- 1.0 mm ultra-thin profile for space-constrained designs.

Q:Why choose QFN-36 over alternatives?

A:Critical advantages:
- Miniaturization: 40% smaller footprint than equivalent SOIC packages.
- Thermal Performance: Direct PCB heat path via exposed thermal pad.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-frequency applications.
- Reliability: Moisture-resistant substrate (MSL3 rating).

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 6×6 mm (±0.2 mm tolerance).
- Height: 1.0 mm (max).
- Pin Pitch: 0.5 mm (standard).
- Material: Copper-alloy leads with Ni/Pd/Au plating.
- Temp Range: -40°C to +125°C (industrial grade).

Q:Where is QFN-36 typically applied?

A:Dominant use cases:
- Power Converters: e.g., Buck/boost ICs (e.g., TI TPS62130).
- RF Modules: e.g., Bluetooth/Wi-Fi transceivers (e.g., nRF52840).
- Sensor Interfaces: e.g., MEMS accelerometers (e.g., ADXL345).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: Thermal vias (4×4 array) under central pad for heat sinking.
- Solder Paste: Type 4 (particle size 20–38 μm) recommended for fine pitch.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<15% acceptable).