ALL CATEGORIESQFN-16
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USB change UART QFN-16 USB ICs ROHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3456
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3KB 20KB 1.7V~5.5V 24MHz FLASH QFN-16 Microcontroller Units (MCUs/MPUs/SOCs) ROHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2744
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Attenuators .1-15GHz 6 bit LSB .5dB Attn 31.5dB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5151
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RF MOSFET Transistors 4-6GHz 5W 32Volt P3dB 38.4 dBm GaN
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9989
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RF JFET Transistors 8-12GHz 5W GaN PAE 50% Gain 13dB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8659
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2GHZ FEM IN 3X3MM PACKAGE
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9184
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IC CLK BUFFER 2:4 1.25GHZ 16QFN
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8255
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RF Switch ICs 5-6000MHz SPDT
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5412
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Attenuators 50-6000MHz 7-Bit 31.75dB .25dB step
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6829
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Shift Register 3-State
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8782
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RF ATTENUATOR 20DB 16VFQFN
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6155
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RF ATTENUATOR 7DB 50OHM 16VFQFN
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5766
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RF ATTENUATOR 30DB 50OHM 16VFQFN
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9467
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IC MMCI GAAS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9883
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IC RF ATTENUATOR
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 7791
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FILTER LC(PI) 100 OHM/12PF SMD
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8858
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RF Amplifier 6 - 20 GHz Low Noise Amplifier
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9737
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RF Amplifier 6 - 11 GHz Low Noise Amplifier
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6508
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RF Amplifier 6 - 18 GHz Low Noise Amplifier
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9961
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RF Switch ICs DC 18GHz High Isolation SPDT Switch
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6493
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RF Switch ICs Green 16 lead 3x3 QFN
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 100000
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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10 bits SPI Accelerometer, 3.3/5V, XY, 50g, QFN 16
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5296
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Universal 2:2 low-jitter clock buffer/level translator
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10000
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5000
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XR21V1410 Series 12 Mbps 3.63 V Quad Channel USB UART
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 564
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2A,24V Input, 600kHz 2/3-Cell Switching Li-ion Battery Charger
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1 + 10 + 25 + 50 + >=100 -
1
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Automotive Grade 4A Low Quiescent Current 1.6MHz - 4x4 16ld HT SUSA CODE:8542390000
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6961
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Automotive Grade 3A Low Quiescent Current Buck Regulator - HT SUSA CODE:8542390000
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6623
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Pb-Free PWM CONTROLLER,DDR REGULATOR,16 LD 4x4 QFN, IND, 1K HT SUSA CODE:8542390000
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1663
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ISL58800CRZ Pb-Free Laser Diode Driver for READ only applica
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1953
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Low Power 12-Bit Magnetic Rotary Encoder
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 883
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10-bit magnetic position sensor with digital angle (interface) output HT SUSA CODE:8542399000
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6635
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MULTICHANNEL FSK TRANSMITTER HT SUSA CODE:8542399000
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6274
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Multi-Channel Narrowband FSK Transmitter
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1351
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Comparator Quad ±8V/16V 16-Pin QFN EP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2824
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Up/Down Conv Mixer 40GHz 16-Pin CLLCC T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 150
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Analog Multiplexer, 4:1, 2 Circuits, 78 ohm, 3V to 16V, ± 3V to ± 8V, Mini QFN-16
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3000
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Up/Down Conv Mixer 3V 40000MHz 16Pin QFN T/R
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1 + 10 + 25 + 50 + >=100 -
1
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Controller 16Pin QFN EP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 20
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3.3V 155-3200Mbps CML Post Amp, 16 VQFN 3x3x0.9mm T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 62
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RF Front End 5G 11ac FEM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 823
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IC REG BUCK ADJ 10A SYNC
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 278176
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5 GHz, 802.11n/ac Front-End Module
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1900
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2206
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 35000
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MP8761 Series 18 V 8 A 1 MHz Synchronous Step-Down Converter - QFN-16
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1691
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IC MOTOR DRIVER
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 26705
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Q:What defines the physical structure of QFN-16?
A:Key features include:
- Leadless bottom-mounted pads: Ensures direct PCB connectivity without protruding leads.
- Central thermal pad: 4×4 mm coverage (typical) for enhanced heat dissipation.
- 16-pin layout: Quad-flat arrangement with perimeter pads.
- Ultra-thin profile: 0.9 mm height for space-constrained designs. -
Q:Why choose QFN-16 over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller footprint than equivalent SOIC-16 packages.
- Thermal Performance: Direct PCB heat path via the central thermal pad.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-frequency applications.
- Reliability: Moisture-resistant substrate (MSL3 rating). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 4×4 mm (varies by vendor).
- Height: 0.9 mm (nominal).
- Pin Pitch: 0.5 mm.
- Material: Copper-alloy leads with matte Sn plating.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is QFN-16 typically applied?
A:Dominant use cases:
- Power Converters: e.g., DC-DC buck regulators (TPS62130).
- RF Modules: e.g., Bluetooth/Wi-Fi transceivers (NRF51822).
- Sensor Interfaces: e.g., MEMS accelerometers (ADXL345). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 via array under the thermal pad (0.3 mm diameter recommended).
- Solder Paste: Type 4 (fine powder) for reliable pad wetting.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory due to hidden solder joints.