QFN64

Q:What defines the physical structure of QFN64?

A:Key features include:
- Leadless bottom-mounted pads: Ensures reliable PCB connections without protruding leads.
- Central thermal pad: 4×4 mm coverage (typical) for enhanced heat dissipation.
- 64-pin layout: Quadruple-row arrangement with perimeter I/O pads.
- Ultra-thin profile: 0.9 mm thickness for space-constrained designs.

Q:Why choose QFN64 over alternatives?

A:Critical advantages:
- Miniaturization: 40% smaller footprint than equivalent TQFP64 packages.
- Thermal Performance: Direct PCB heat path via exposed thermal pad.
- Electrical Benefits: Low-inductance (<0.5 nH) and short signal paths.
- Reliability: Moisture-resistant (MSL3) substrate with halogen-free materials.

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 9×9 mm (varies by vendor).
- Height: 0.9 mm (nominal).
- Pin Pitch: 0.5 mm (fine-pitch design).
- Material: Copper-alloy leads with Ni/Pd/Au plating.
- Temp Range: -40°C to +125°C (industrial grade).

Q:Where is QFN64 typically applied?

A:Dominant use cases:
- Power Management: DC-DC converters (e.g., TI TPS62130).
- RF/Wireless: Bluetooth/Wi-Fi modules (e.g., NRF52840).
- Embedded Systems: Microcontrollers (e.g., STM32F4 series).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: 4×4 thermal via array (0.3 mm diameter) under the pad.
- Solder Paste: Type 4 (20–38 μm particle size) for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 250°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<15% acceptable).