QFN20

Q:What defines the physical structure of QFN20?

A:Key features include:
- Leadless bottom-mounted pads for direct PCB connectivity.
- Central thermal pad (4×4 mm coverage) for enhanced heat dissipation.
- 20-pin layout with peripheral array for compact signal routing.
- 0.9 mm ultra-thin profile for space-constrained designs.

Q:Why choose QFN20 over alternatives?

A:Critical advantages:
- Miniaturization: 30% smaller than equivalent SOIC packages.
- Thermal Performance: Direct PCB heat path via exposed thermal pad.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 rating).

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 5×5 mm.
- Height: 0.9 mm.
- Pin Pitch: 0.5 mm.
- Material: Copper-alloy leads with Ni/Pd/Au plating.
- Temp Range: -40°C to +125°C.

Q:Where is QFN20 typically applied?

A:Dominant use cases:
- Power Converters: e.g., Buck/boost ICs (e.g., TPS62130).
- RF Modules: e.g., Bluetooth/Wi-Fi transceivers (e.g., nRF52840).
- Sensor Interfaces: e.g., MEMS accelerometers (e.g., LIS2DH12).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: Thermal vias (4×4 array) under central pad.
- Solder Paste: Type 4 solder recommended for fine-pitch reliability.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection.