PLCC32
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
-
-
2 Megabit (256 K x 8-Bit) CMOS 3.0 Volt-only, Uniform Sector 32-Pin Flash Memory
-
1 + 10 + 25 + 50 + >=100 -
1
-
-
8K X 8 EEPROM,CMOX,HIGH SPEED,PLCC,COMM TEMP,70NS,PB FREE,T& HT SUSA CODE:8542320050
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5123
-
-
64K, 8K x 8 Bit; 5 Volt, Byte Alterable EEPROM; Temperature Range: 0°C to 70°C; Package: 32-PLCC T&R
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5021
-
-
8K X 8 EEPROM,CMOS,HIGH SPEED,PLCC,120NS,PB FREE,T&R HT SUSA CODE:8542320050
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 123
-
-
64K, 8K x 8 Bit; 5 Volt, Byte Alterable EEPROM; Temperature Range: -55°C to 125°C; Package: 32-PLCC
-
1 + 10 + 25 + 50 + >=100 -
1
-
-
64K, 8K x 8 Bit; 5 Volt, Byte Alterable EEPROM; Temperature Range: -40°C to 85°C; Package: 32-PLCC T&R
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1687
-
-
8K X 8 EEPROM CMOS, 32 LEAD PLCC, IND., 70NS, PB FREE,T&R HT SUSA CODE:8542320050
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5147
-
-
64K, 8K x 8 Bit; 5 Volt, Byte Alterable EEPROM; Temperature Range: -40°C to 85°C; Package: 32-PLCC
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 695
-
Q:What defines the physical structure of PLCC32?
A:Key features include:
- J-lead design: Bent inward leads for surface-mount compatibility.
- Central cavity: Exposed die pad for thermal dissipation.
- 32-pin layout: Pins arranged in a square perimeter (4 sides × 8 pins).
- Compact profile: Typical body thickness of 2.0–3.0 mm. -
Q:Why choose PLCC32 over alternatives?
A:Critical advantages:
- Space efficiency: 30% smaller footprint than equivalent DIP packages.
- Thermal Performance: Direct PCB heat sinking via J-leads.
- Electrical Benefits: Low-inductance leads for high-frequency signals.
- Reliability: Molded plastic body with moisture resistance (JEDEC Level 3). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 11.43 × 11.43 mm (standard).
- Height: 2.0–3.0 mm.
- Pin Pitch: 1.27 mm (50 mil).
- Material: Copper-alloy leads with Sn/Pb or lead-free plating.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is PLCC32 typically applied?
A:Dominant use cases:
- Embedded systems: Microcontrollers (e.g., legacy 8051 variants).
- Communication: RF modules (e.g., Bluetooth/Wi-Fi transceivers).
- Industrial controls: PLCs and sensor interfaces (e.g., optoisolators). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Ensure proper J-lead solder fillets; avoid tombstoning.
- Solder Paste: Type 3 recommended for fine-pitch reliability.
- Reflow Profile: Peak temperature ≤ 250°C (lead-free process).
- Inspection: Visual or AXI for hidden joint defects.



ALL CATEGORIES