PLCC28
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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High-Performance Electrically Erasable PLD, Zero Power
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 725
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High-performance Electrically Erasable PLD, Vcc of 3.0 - 5.5V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 417
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Z8 Microcontroller - Z86E83 Series; RAM (Bytes): --; RAM (bytes): 237; Other Features: POR; Speed (MHz): 16; Pin Count: 28; Package: PDIP,PLCC,SOIC; 8-bit Timers: 2; Program Memory: OTP; Voltage Range: 3.5-5.5V; ROM (KB): 4; Analog Features: 2 comp;
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5288
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Z8 Microcontroller - Z86E34 Series; RAM (Bytes): --; RAM (bytes): 237; Other Features: POR,LV Protect; Speed (MHz): 12; Pin Count: 28; Package: PDIP,PLCC,SOIC; 8-bit Timers: 2; Program Memory: OTP; Voltage Range: 3.5-5.5V; ROM (KB): 16; Analog Featur
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5288
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Q:What defines the physical structure of PLCC28?
A:Key features include:
- J-lead design: Gull-wing leads for surface-mount compatibility.
- Central thermal pad: Optional pad (typically 40% coverage) for heat dissipation.
- 28-pin layout: Leads arranged in a square perimeter (7 pins per side).
- Compact profile: Standard height of 3.5–4.0 mm. -
Q:Why choose PLCC28 over alternatives?
A:Critical advantages:
- Space efficiency: 30% smaller footprint than DIP28 packages.
- Thermal Performance: J-leads and thermal pad enable dual heat dissipation paths.
- Electrical Benefits: Low-inductance leads for stable high-frequency signals.
- Reliability: Molded plastic body with moisture resistance (MSL3 rated). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 11.5 × 11.5 mm (square).
- Height: 3.5–4.0 mm.
- Pin Pitch: 1.27 mm (uniform spacing).
- Material: Copper-alloy leads with Sn/Pb or lead-free plating.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is PLCC28 typically applied?
A:Dominant use cases:
- Embedded systems: Microcontrollers (e.g., legacy 8051 variants).
- Communication ICs: RF transceivers (e.g., Nordic nRF24L01+).
- Industrial controls: Sensor interfaces and motor drivers. -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Ensure pad dimensions match J-lead curvature (IPC-7351 standards).
- Solder Paste: Type 3 or 4 recommended for fine-pitch leads.
- Reflow Profile: Peak temperature ≤ 250°C (lead-free) or 220°C (Sn/Pb).
- Inspection: Optical/AXI required to verify solder joint integrity under leads.



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