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LQFP -128

The LQFP-128 (Low-profile Quad Flat Package with 128 pins) is a surface-mount package designed for high-density circuits. Featuring a low profile, exposed thermal pad, and fine pitch leads, it delivers compact footprint, superior heat dissipation, and enhanced electrical performance. Typical dimensions are 14×14 mm with a height of 1.4 mm and a 0.5 mm pin pitch, making it ideal for microcontrollers in embedded systems, communication ICs, and portable devices. Its exposed thermal pad enables direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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  • ADC08D1020CIYB
  • ADC08D1020CIYB

    Manufacturer: TI

    Package/Case: LQFP -128

  • ADC08D1020 Low Power, 8-Bit, Dual 1.0 GSPS or Single 2.0 GSPS A/D Converter; Package: LQFP EXP PAD; No of Pins: 128; Qty per Container: 60; Container: Tray
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    >=100
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