LQFP -128
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Q:What defines the physical structure of LQFP-128?
A:Key features include:
- Leaded design: Gull-wing leads for reliable PCB mounting.
- Central thermal pad: Optional 10×10 mm pad (80% coverage) for enhanced heat dissipation.
- High pin count: 128-pin layout with perimeter lead arrangement.
- Low profile: Standard 1.4 mm thickness for space-constrained applications. -
Q:Why choose LQFP-128 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller footprint than QFP-128 with similar functionality.
- Thermal Performance: Exposed die pad enables direct PCB heat sinking (ΔRth reduced by 25%).
- Electrical Benefits: Short lead frames minimize inductance (<1 nH per pin).
- Reliability: Molded epoxy body with MSL3 moisture resistance. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 14×14 mm (±0.2 mm tolerance).
- Height: 1.4 mm (nominal).
- Pin Pitch: 0.4 mm (fine-pitch compatible).
- Material: Copper-alloy leads with matte Sn plating.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is LQFP-128 typically applied?
A:Dominant use cases:
- Embedded Systems: STM32F4 MCUs, NXP i.MX RT processors.
- Communication ICs: Ethernet PHYs (e.g., KSZ9031).
- Automotive ECUs: Infineon Aurix TC3xx series. -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4-layer board with thermal vias under pad (0.3 mm diameter recommended).
- Solder Paste: Type 4 (20–38 μm particle size) for fine-pitch printing.
- Reflow Profile: Ramp rate ≤2°C/s, peak temp 235–245°C (Pb-free).
- Inspection: AXI (Automated X-ray) required for lead coplanarity checks.



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