LL34

Q:What defines the physical structure of LL34?

A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad (80% coverage): Enhances heat dissipation.
- 2-pin layout with side-by-side arrangement: Simplified connectivity.
- 1.0 mm ultra-thin profile: Saves vertical space in compact designs.

Q:Why choose LL34 over alternatives?

A:Critical advantages:
- Miniaturization: 30% smaller than SOD-123 packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 15%.
- Electrical Benefits: Low-inductance design (<1 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 rating).

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 3.5 × 1.6 mm
- Height: 1.0 mm
- Pin Pitch: 1.2 mm
- Material: Copper-alloy leads with matte-tin plating.
- Temp Range: -40°C to +125°C.

Q:Where is LL34 typically applied?

A:Dominant use cases:
- Power Converters: Buck/boost circuits (e.g., TI TPS62130).
- RF Modules: Antenna matching networks (e.g., Skyworks SKY66421).
- Sensor Interfaces: IoT node signal conditioning (e.g., Bosch BME280).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: Thermal vias under pad (4×4 array, 0.3 mm diameter).
- Solder Paste: Type 4 solder recommended for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (ramp rate 2°C/sec).
- Inspection: X-ray (AXI) mandatory to verify voiding <10%.