LGA-16
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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IMUs - Inertial Measurement Units 6-axis MotionTracking device that combines a 3-axis gyroscope, 3-axis accelerometer, in a small 3x3x0.75mm
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9100
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Analog Circuit, 1 Func, 4.50 X 3MM, 0.95MM HEIGHT, LGA-16
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4000
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MEMS Accelerometer, 3-Axis, Digital, X, Y, Z, 2g, 4g, 8g, LGA, 3.6V, 1.8V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4000
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Accelerometers Accelerometer + Magnetometer e-compass solution
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2178
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6D Inertial Measurement Unit with Motion Processing Unit and Sensor Fusion Library Digital Output 2.7V 16-Pin LGA EP T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2168
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IMUs - Inertial Measurement Units High-performance IMU BMI085 for virtual and augmented reality applications
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 20
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Optimized for Image Stabilization Applications with 3-axis of Compensation
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 52880
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Accelerometer and Temperature Digital Output 2V 16-Pin LGA T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10
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WCDMA/HSUPA PA-Duplexer Module; SE Input w/Coupler, Detector,RF Amplifier WCDMA IMT2100 Band PA/Duplexer Module
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1214
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WCDMA/HSUPA PA-Duplexer Module; SE Input w/Coupler, Detector,RF Amplifier WCDMA US PCS-Band PA/Duplexer Module
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1952
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WCDMA / HSDPA PA-Duplexer Module; SE Input w/Coupler, Detector,RF Amplifier WCDMA US Cell-Band PA/Duplexer Module
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 424
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Accelerometers - Board Mount 3-AXIS W/ 32BIT MCU
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
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Xtrinsic Motion Sensing Platform with Lightweigh infrastructure
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
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Accelerometers - Board Mount 3-AXIS LOW G PEDOMETER
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
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Accelerometers - Board Mount 3-AXIS LOW G PEDOMETER
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 82000
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Accelerometers - Board Mount 3-axis accel w/ 32-bit M
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
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Accelerometers - Board Mount 3-axis accel w/ 32-bit M
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2500
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Accelerometers - Board Mount 3-axis accel w/ 32-bit M
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
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LY550ALH Series 3.6V ?00?s High Performance Analog Yaw-Rate Gyroscope - LGA-16
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 24000
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SPECIALTY ANALOG CIRCUIT, PBGA16, 5 X 5MM, 1.5MM HEIGHT, ROHS COMPLIANT, PLASTIC, LGA-16
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 15928
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SPECIALTY ANALOG CIRCUIT, PBGA16, 5 X 5MM, 1.5MM HEIGHT, GREEN, PLASTIC, LGA-16
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 16045
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SPECIALTY ANALOG CIRCUIT, PBGA16, 5 X 5MM, 1.5MM HEIGHT, GREEN, PLASTIC, LGA-16
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 45000
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SPECIALTY ANALOG CIRCUIT, PBGA16, 5 X 5MM, 1.5MM HEIGHT, ROHS COMPLIANT, PLASTIC, LGA-16
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 12000
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SPECIALTY ANALOG CIRCUIT, PBGA16, 5 X 5MM, 1.5MM HEIGHT, GREEN, PLASTIC, LGA-16
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 16044
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Accelerometers - Board Mount e-compass 3D MEMS 16bit 3 ACC 3 MAG IMU ACCEL/MAG I2C/SPI
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 45200
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MEMS Module, Tri-Axis Accelerometer, Tri-Axis Magnetometer, 2.16 V, 3.6 V, LGA, 16 Pins
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 25000
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Q:What defines the physical structure of LGA-16?
A:Key features include:
- Leadless bottom-mounted pads for direct PCB attachment
- Central thermal pad (70% coverage) for enhanced heat dissipation
- 16-pin layout with 4×4 grid arrangement
- 1.0 mm ultra-thin profile for space-constrained designs -
Q:Why choose LGA-16 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller than equivalent QFN packages
- Thermal Performance: Direct PCB heat path reduces junction temperature by ~15%
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-frequency stability
- Reliability: Moisture-resistant substrate (MSL3 compliant) -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 3.0 × 3.0 mm
- Height: 1.0 mm
- Pin Pitch: 0.5 mm
- Material: Copper-alloy contacts with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C -
Q:Where is LGA-16 typically applied?
A:Dominant use cases:
- IoT Sensors (e.g., Bosch BME280 environmental sensor)
- Power Management ICs (e.g., TI TPS62740 ultra-low-power converter)
- RF Modules (e.g., Nordic nRF52840 Bluetooth SoC) -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal via array under central pad (0.3 mm diameter)
- Solder Paste: Type 4 solder recommended for fine-pitch reliability
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process)
- Inspection: X-ray (AXI) mandatory for void detection (<15% acceptable)



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