LGA

Q:What defines the physical structure of LGA?

A:Key features include:
- Leadless bottom-mounted pads: Ensures direct PCB contact for low-profile designs.
- Central thermal pad: Typically covers 60–80% of the package base for heat dissipation.
- High-density pin layout: Supports 100+ pins with matrix arrangement (e.g., 10×10 grid).
- Ultra-thin profile: Ranges from 0.8–1.5 mm thickness for space-constrained applications.

Q:Why choose LGA over alternatives?

A:Critical advantages:
- Miniaturization: 30–50% smaller footprint than equivalent QFN packages.
- Thermal Performance: Direct PCB heat path via thermal pads reduces junction temperature by 15–20%.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-frequency signals.
- Reliability: Moisture-resistant substrate (MSL3 rating) and robust solder joints.

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 7×7 mm to 45×45 mm (scalable).
- Height: 0.8–2.5 mm (varies by pin count).
- Pin Pitch: 0.5–1.27 mm (fine-pitch options available).
- Material: Copper-alloy pads with FR4 or ceramic substrates.
- Temp Range: -40°C to +125°C (industrial grade).

Q:Where is LGA typically applied?

A:Dominant use cases:
- Power Converters: High-current ICs (e.g., TI LMR33630).
- RF Modules: 5G/Wi-Fi FEMs (e.g., Qorvo QPF7251).
- Sensor Interfaces: MEMS devices (e.g., Bosch BME688).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: Thermal vias under the pad (≥4 vias/mm²).
- Solder Paste: Type 4 (for fine-pitch pads).
- Reflow Profile: Peak temp ≤245°C (SnAgCu alloys).
- Inspection: X-ray (AXI) mandatory for hidden joint defects.