LCC-16

Q:What defines the physical structure of LCC-16?

A:Key features include:
- Leadless bottom-mounted pads: Ensures robust PCB connectivity.
- Central thermal pad (80% coverage): Enhances heat dissipation.
- 16-pin layout with perimeter array: Optimizes space and signal routing.
- 1.4 mm ultra-thin profile: Ideal for compact designs.

Q:Why choose LCC-16 over alternatives?

A:Critical advantages:
- Miniaturization: 30% smaller than SOIC-16.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 15%.
- Electrical Benefits: Low-inductance design (<1 nH) for high-frequency stability.
- Reliability: Moisture-resistant ceramic substrate (JEDEC Level 1 compliant).

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 5.0 × 5.0 mm
- Height: 1.4 mm
- Pin Pitch: 0.65 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C

Q:Where is LCC-16 typically applied?

A:Dominant use cases:
- Power Converters: e.g., Buck/boost ICs (e.g., TPS62130).
- RF Modules: e.g., Bluetooth/Wi-Fi transceivers (e.g., CC2640).
- Sensor Interfaces: e.g., MEMS accelerometers (e.g., LIS3DH).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: Thermal vias (4×4 array) under central pad.
- Solder Paste: Type 4 solder recommended for fine-pitch reliability.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection.