Hockey puck

Q:What defines the physical structure of Hockey puck?

A:Key features include:
- Leadless bottom-mounted pads: Ensures direct PCB connectivity.
- Central thermal pad (80% coverage): Optimizes heat dissipation.
- 16-pin layout with radial symmetry: Balanced signal distribution.
- 2.5 mm ultra-thin profile: Saves vertical space in compact designs.

Q:Why choose Hockey puck over alternatives?

A:Critical advantages:
- Miniaturization: 40% smaller than standard QFN packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 30%.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-frequency stability.
- Reliability: Moisture-resistant ceramic substrate (IPC-610 Class 3 compliant).

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 8×8 mm
- Height: 2.5 mm
- Pin Pitch: 0.65 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +150°C

Q:Where is Hockey puck typically applied?

A:Dominant use cases:
- Power Converters: e.g., Buck/boost regulators (e.g., TI TPS62130).
- RF Modules: e.g., 5G mmWave transceivers (e.g., ADI ADMV4828).
- Sensor Interfaces: e.g., MEMS pressure sensors (e.g., Bosch BMP580).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: Thermal vias (4×4 array) under central pad required.
- Solder Paste: Type 4 solder (particle size 20–38 μm) recommended.
- Reflow Profile: Peak temp ≤ 250°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<15% tolerance).