ALL CATEGORIESFBGA-78
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DRAM Chip DDR4 SDRAM 16Gbit 2Gx8 1.2V 78-Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9767
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Memory
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4010
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1508
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DDR4 1Gx8 PC2400
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2000
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 100
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Chip SDRAM 4GBIT 933MHZ 78FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 100
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Chip SDRAM 4GBIT 933MHZ 78FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2250
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4
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DRAM Chip DDR3L SDRAM 4Gbit 512Mx8 1.35V 78-Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5000
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DRAM Chip DDR3L SDRAM 2Gbit 256Mx8 1.35V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 627
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4Gb: x8 DDR3 SDRAM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 51
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DDRⅢ FBGA 256x8 1333 RoHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 245
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DDR3 256Mx8 PC1333
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 320
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DDR3 128Mx8 PC1333
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 625
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4Gb: x8 Automotive DDR3L SDRAM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 305
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Chip SDRAM 2GBIT 800MHZ 78FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 35
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DRAM Chip DDR3L SDRAM 2Gbit 256Mx8 1.35V Automotive 78-Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 40
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Chip SDRAM 8GBIT 667MHZ 78FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1665
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IC DDR3L SDRAM 4GBIT 78FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1665
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DRAM Chip DDR3L SDRAM 4Gbit 1Gx4 1.35V 78Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1665
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DRAM Chip DDR3L SDRAM 4G-Bit 1Gx4 1.35V 78Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1665
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IC DDR3L SDRAM 4GBIT 78FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1665
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IC DDR3 SDRAM 1GBIT 78FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 299
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DRAM Chip DDR3L SDRAM 1G-Bit 128Mx8 1.35V 78-Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1307
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Fuse Holder 20A 600V Through Hole Quick Connect Bulk
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 816
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IC DDR3 SDRAM 4GBIT 78FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 974
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4Gb: x8 DDR3 SDRAM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 98
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DRAM Chip DDR3 SDRAM 4G-Bit 512Mx8 1.5V 78-Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 60
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2Gb: x8 DDR3 SDRAM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 508
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IC DDR3 SDRAM 2GBIT 78FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10
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DDR3 256Mx8 PC1333 Low power
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4723
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IC DDR3 SDRAM 1GBIT 78FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1568
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IC DDR3 SDRAM 4GBIT 78FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 926
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IC DDR3 SDRAM 1GB 78FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1665
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MODULE DDR3 SDRAM 1GB 78FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8832
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DRAM Chip DDR3 SDRAM 2G-Bit 256Mx8 1.5V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 322
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DDR3 256Mx8 PC1066
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2522
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1Gb G-die DDR3 SDRAM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1565
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1G, 1.5V, DDR3, 128Mx8, 1333MT/s @ 8-8-8, 78 ball BGA (8mm x10.5mm) RoHS, T&R
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1 + 10 + 25 + 50 + >=100 -
1
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1G, 1.5V, DDR3, 128Mx8, 1333MT/s @ 8-8-8, 78 ball BGA (8mm x10.5mm) RoHS, IT, T&R
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1 + 10 + 25 + 50 + >=100 -
1
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DRAM Chip DDR3 SDRAM 1G-Bit 128M x 8 1.5V 78Pin TW-BGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 210
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1G, 1.5V, DDR3, 128Mx8, 1333MT/s @ 8-8-8, 78 ball BGA (8mm x10.5mm) RoHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 210
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1G, 1.5V, DDR3, 128Mx8, 1600MT/s @ 10-10-10, 78 ball BGA (8mm x10.5mm) RoHS, IT, T&R
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1 + 10 + 25 + 50 + >=100 -
1
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1G, 1.5V, DDR3, 128Mx8, 1600MT/s @ 10-10-10, 78 ball BGA (8mm x10.5mm) RoHS, IT
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 210
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DDR3 64Mx64 PC1333 ORI [64MX8 8C]
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 203
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DDR3 512Mx8 PC1600
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10
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DRAM Chip DDR3 SDRAM 2G-Bit 256M x 8 1.5V 78-Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3500
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DDR3 256Mx8 PC1600
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 129
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DDR3 256Mx8 PC1600
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 181
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DDR3 128Mx8 PC1333 CL9
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 359
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Q:What defines the physical structure of FBGA-78?
A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad (70% coverage): Enhances heat dissipation.
- 78-pin layout with perimeter array: Optimizes signal routing density.
- 1.0 mm ultra-thin profile: Saves vertical space in compact designs. -
Q:Why choose FBGA-78 over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller footprint than similar QFN packages.
- Thermal Performance: Direct PCB heat path via thermal pad reduces junction temperature by 15%.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-speed signals.
- Reliability: Moisture-resistant substrate (MSL3 certified). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 8.0 × 8.0 mm
- Height: 1.0 mm
- Pin Pitch: 0.5 mm
- Material: Copper-alloy pads with solder mask coating.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is FBGA-78 typically applied?
A:Dominant use cases:
- Power Converters: E.g., POL regulators (e.g., TPS62130).
- RF Modules: E.g., Bluetooth/Wi-Fi SoCs (e.g., ESP32 series).
- Sensor Interfaces: E.g., MEMS accelerometers (e.g., LIS2DH12). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Use 4×4 thermal vias under the central pad (0.3 mm diameter).
- Solder Paste: Type 4 solder (particle size 20–38 μm) recommended.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<15% tolerance).