FBGA169

Q:What defines the physical structure of FBGA169?

A:Key features include:
- Leadless bottom-mounted pads: Ensures reliable solder joints and compact PCB footprint.
- Central thermal pad (70% coverage): Enhances heat dissipation for high-power applications.
- 169-pin layout with perimeter array: Optimizes pin density and signal routing flexibility.
- 1.0 mm ultra-thin profile: Ideal for space-constrained designs.

Q:Why choose FBGA169 over alternatives?

A:Critical advantages:
- Miniaturization: 40% smaller than comparable QFP packages.
- Thermal Performance: Direct PCB heat path via thermal pad reduces junction temperature by 15–20%.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-speed signals.
- Reliability: Moisture-resistant substrate (MSL3 certified) for harsh environments.

Q:What are common technical specs for FBGA169?

A:Standard configurations (consult datasheets):
- Body Size: 10×10 mm
- Height: 1.0 mm
- Pin Pitch: 0.8 mm
- Material: Copper-alloy interposer with SnAgCu solder balls.
- Temp Range: -40°C to +125°C (industrial grade).

Q:Where is FBGA169 typically applied?

A:Dominant use cases:
- Networking: High-speed switches (e.g., Broadcom BCMxxxx series).
- Consumer Electronics: Compact processors (e.g., ARM Cortex-M MCUs).
- Automotive: ADAS sensor interfaces (e.g., NXP S32K MCUs).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: 4×4 thermal via array under central pad (0.3 mm diameter).
- Solder Paste: Type 4 (5–15 μm particle size) for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 250°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<15% tolerance).