FAN ACDC

Q:What defines the physical structure of FAN ACDC?

A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment and space efficiency.
- Central thermal pad (90% coverage): Maximizes heat dissipation to the PCB.
- 16-pin layout with dual-row perimeter arrangement: Balances pin density and routing flexibility.
- 1.0 mm ultra-thin profile: Ideal for height-constrained applications.

Q:Why choose FAN ACDC over alternatives?

A:Critical advantages:
- Miniaturization: 40% smaller footprint than TO-220 packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 25%.
- Electrical Benefits: Low-inductance design (<1 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 certified).

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 5.0 × 5.0 mm
- Height: 1.0 mm
- Pin Pitch: 0.5 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C

Q:Where is FAN ACDC typically applied?

A:Dominant use cases:
- Power Converters: AC/DC modules (e.g., 100W buck converters).
- RF Modules: 5G baseband units (e.g., mmWave transceivers).
- Sensor Interfaces: High-precision IoT sensors (e.g., industrial pressure sensors).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: 4×4 thermal vias array under the central pad (0.3 mm diameter).
- Solder Paste: Type 4 solder (particle size 20–38 µm) for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process recommended).
- Inspection: X-ray (AXI) mandatory for void detection (<15% tolerance).