EMI

Q:What defines the physical structure of EMI shielding packages?

A:Key features include:
- Metallic Shielding Can: Seamless metal enclosure (e.g., nickel-plated steel) for full EMI isolation.
- Grounding Pads: Perimeter solder tabs for direct PCB grounding.
- Customizable Cavity: Adjustable height (e.g., 0.5–3.0 mm) to accommodate components.
- Snap-Fit or Solderable Lids: Removable/reworkable options for testing.

Q:Why choose EMI shielding packages over alternatives?

A:Critical advantages:
- EMI Suppression: Blocks >30 dB interference up to [X] GHz.
- Space Efficiency: 20% thinner than shielded enclosures.
- Thermal Dissipation: Integrated heat-spreading layers (e.g., copper core).
- Compliance: Meets FCC Part 15, IEC 61000-4-3 standards.

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 5×5 mm to 50×50 mm (customizable).
- Height: 0.8–3.0 mm (including lid).
- Shielding Effectiveness: ≥60 dB @ 1 GHz.
- Material: Nickel-plated steel or copper-beryllium alloy.
- Temp Range: -40°C to +125°C.

Q:Where are EMI shielding packages typically applied?

A:Dominant use cases:
- Wireless Modules: 5G/Wi-Fi/BT (e.g., Qualcomm QCM6490).
- Medical Devices: Implantable sensors (e.g., pacemaker ICs).
- Automotive: ADAS radar (e.g., NXP TEF82xx).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: Continuous ground plane under shield; 0.3-mm keepout zone.
- Solder Paste: SAC305 alloy, stencil thickness ≤100 µm.
- Reflow Profile: Ramp rate ≤2°C/s, peak 250°C (SnAgCu).
- Inspection: AXI for solder joint voids (<10% area).