DIP ROHS

Q:What defines the physical structure of DIP (ROHS)?

A:Key features include:
- Through-hole mounting: Robust pins for secure PCB insertion.
- Standardized pin layout: Typically 8 to 40 pins in dual parallel rows.
- Body material: Molded plastic (ROHS-compliant epoxy resin).
- Pin spacing: 2.54 mm (0.1 inch) industry-standard pitch.

Q:Why choose DIP (ROHS) over alternatives?

A:Critical advantages:
- Ease of prototyping: Manual soldering-friendly for lab development.
- Mechanical stability: Pins resist vibration/shock better than SMD.
- ROHS compliance: Lead-free (Pb-free) pins and housing.
- Cost-effective: Low tooling requirements for legacy systems.

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 7.62 mm × 10.16 mm (e.g., 14-pin variant).
- Height: 3.3 mm (typical).
- Pin Pitch: 2.54 mm (fixed).
- Material: Copper-alloy pins with tin plating.
- Temp Range: -40°C to +85°C (industrial grade).

Q:Where is DIP (ROHS) typically applied?

A:Dominant use cases:
- Legacy electronics: Microcontrollers (e.g., ATmega328P).
- Industrial controls: PLC modules and relay drivers.
- Educational kits: Breadboard-friendly ICs (e.g., 74HC logic series).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: 0.9–1.0 mm hole diameter for pin insertion.
- Soldering: Wave soldering preferred (or hand-soldering with lead-free solder).
- Cleaning: Remove flux residues (ROHS-compliant cleaners).
- Inspection: Visual check for pin alignment and solder fillets.