ALL CATEGORIESDIP-28
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32KB 2KB FLASH 26 4.2V~5.5V 51Series DIP-28 Microcontroller Units (MCUs/MPUs/SOCs) ROHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2623
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Real Time Clock (RTC) IC Clock/Calendar I²C, 2-Wire Serial 24-DIP (0.600", 15.24mm)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 135
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Memory ICs, Atmel AT28C64E-12PU
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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64k-bit static RAM organized 8-kword × 8-bit
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 90
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 100
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
1
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IC Chips
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 110
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IC Chips
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4000
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 300
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IC Chips
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 310
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 106
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Programmable Logic ICs
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 13
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TLCS-870 Series
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1949
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10Bit FET Bus-Exchange Switches with -2V Undershoot Protection 24-SOIC -40℃ to 85℃
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 95
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3200
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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UART Peripheral Control
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1 + 10 + 25 + 50 + >=100 -
1
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
1
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Image Sensor Monochrome CCD 2098x3Pixels 28-Pin CDIP Tube
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 208
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FUMESAFE 120V / 230V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 90
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
1
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 36
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EPROM 512K (64Kx8) 90ns
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1 + 10 + 25 + 50 + >=100 -
1
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
In-stock : 0
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
In-stock : 0
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HIGH SPEED 16K x 8 CMOS EPROM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 650
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Programmable Logic ICs
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1 + 10 + 25 + 50 + >=100 -
In-stock : 0
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
In-stock : 0
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
In-stock : 0
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
In-stock : 0
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
In-stock : 0
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
In-stock : 0
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
In-stock : 0
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
In-stock : 0
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MCU 32-bit LPC1100 ARM Cortex M0 RISC 32KB Flash 3.3V 28-Pin PDIP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 20
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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Commercial Narrowband Voltage Controlled Oscillators
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1 + 10 + 25 + 50 + >=100 -
1
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THREE-PHASE PULSE WIDTH MODULATION WAVEFORM GENERATOR
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 40
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 105
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 750
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 740
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 690
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 213
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 211
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1100
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2000
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Motorola Semiconductor
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 19
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Q:What defines the physical structure of DIP-28?
A:Key features include:
- Through-hole mounting: Dual-row pins for robust mechanical attachment.
- Standardized pin layout: 28-pin configuration with 2.54 mm (0.1") pin spacing.
- Rectangular body: Molded plastic housing with 34.0 × 10.0 mm typical dimensions.
- Lead material: Tin-plated copper alloy leads for solderability. -
Q:Why choose DIP-28 over alternatives?
A:Critical advantages:
- Ease of prototyping: Hand-soldering friendly vs. surface-mount packages.
- Mechanical stability: Secure PCB insertion for high-vibration environments.
- Cost-effectiveness: Lower assembly complexity than fine-pitch packages.
- Legacy compatibility: Widely supported in industrial/retrofit applications. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 34.0 × 10.0 mm (varies by manufacturer).
- Height: 3.5–5.0 mm (excluding leads).
- Pin Pitch: 2.54 mm (standard DIP spacing).
- Material: Flame-retardant epoxy resin (UL94 V-0).
- Temp Range: -40°C to +85°C (industrial grade). -
Q:Where is DIP-28 typically applied?
A:Dominant use cases:
- Legacy electronics: Microcontrollers (e.g., 8051 variants).
- Industrial controls: PLC modules and relay drivers.
- Educational kits: Breadboard-friendly IC packaging. -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 1.0–1.6 mm hole diameter for lead insertion.
- Soldering: Wave soldering preferred; hand-solder with < 300°C iron.
- Cleaning: Isopropyl alcohol for flux residue (avoid ultrasonic for old PCBs).
- Inspection: Visual check for lead straightness and solder fillets.