ALL CATEGORIESDIP-26
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4450
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 299
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TOSHIBA Intelligent Power Device High Voltage Monolithic Silicon Power IC
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 35
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TOSHIBA Intelligent Power Device High Voltage Monolithic Silicon Power IC
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 288
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Motor / Motion / Ignition Controllers & Drivers Intelligent Power Device, 500V, 3A, BLDC motor drive, DIP26
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 25000
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Intelligent Power Device High Voltage Monolithic Silicon Power IC
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2532
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Motor / Motion / Ignition Controllers & Drivers Intelligent Power Device, 500V, 3A, BLDC motor drive, DIP26
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 500
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Intelligent Power Device High Voltage Monolithic Silicon Power IC
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
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Motor / Motion / Ignition Controllers & Drivers Intelligent Power Device, 500V, 2A, BLDC motor drive, DIP26
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 63009
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 295
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10
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MOSFET, Switching; VDSS (V): -60; ID (A): -5; Pch : 20; RDS (ON) typ. (ohm) @10V: 0.14; RDS (ON) typ. (ohm) @4V[4.5V]: 0.2; RDS (ON) typ. (ohm) @2.5V: -; Ciss (pF) typ: -; toff (μs) typ: 10.8; Package: DPAK (S)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 500
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Hitachi America Ltd.
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 380
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Mod ipm 600v 30a dip
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 110
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Intellimod⑩ Module Dual-In-Line Intelligent Power Module 25 Amperes/600 Volts
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1200
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 15757
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 21888
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2340
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 231
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 7500
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 204
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Eight Character 5 mm and 7 mm Smart Alphanumeric Displays,LED Displays Yellow 585nm 5x7 Smart Display
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 208
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 20
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10
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Special Purpose Amplifiers Optically Coupled Linear Iso Amp
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1 + 10 + 25 + 50 + >=100 -
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SDR Connector; No. of Contacts:26; Pitch Spacing:0.8mm; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes,D-Subminiature Connectors 0.8mm 26P R/A RECEPT THRU HOLE 30u GOLD
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3000
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Q:What defines the physical structure of DIP-26?
A:Key features include:
- Through-hole mounting: Traditional dual-in-line design for robust PCB attachment.
- 26-pin layout: Symmetrical dual-row arrangement (13 pins per side).
- Standardized spacing: 2.54 mm (100 mil) pin pitch for compatibility with breadboards and sockets.
- Durable housing: Molded plastic body with ±0.2 mm dimensional tolerance. -
Q:Why choose DIP-26 over alternatives?
A:Critical advantages:
- Ease of prototyping: Compatible with solderless breadboards and hand-soldering.
- Mechanical stability: Robust through-hole design resists vibration/shock.
- Cost-effectiveness: Lower assembly complexity vs. SMD packages.
- Legacy support: Widely used in industrial/educational systems (e.g., Arduino shields). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 33.0 × 7.62 mm (standard DIP width).
- Height: 3.3–4.0 mm (varies by manufacturer).
- Pin Pitch: 2.54 mm (fixed).
- Material: Plastic body with tin-plated copper alloy leads.
- Temp Range: -40°C to +85°C (industrial grade). -
Q:Where is DIP-26 typically applied?
A:Dominant use cases:
- Embedded systems: Legacy microcontrollers (e.g., ATmega328 in DIP-26).
- Industrial controls: PLC modules and relay drivers.
- Educational kits: Electronics training boards (e.g., 74-series logic ICs). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 1.0–1.6 mm hole diameter for lead insertion.
- Soldering: Manual or wave soldering (260°C max, 5 sec exposure).
- Cleaning: IPA recommended to remove flux residues.
- Inspection: Visual check for bent pins or solder bridges.