ALL CATEGORIESDIP-10
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DC-DC DIP-10 Power Modules ROHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5795
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DC-DC DIP-10 Power Modules ROHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6044
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 90
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
1
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DS relay
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
1
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TERM SCREW M3 10 PIN PCB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 30
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 91
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SLIM POLARIZED RELAY
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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N/A
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1 + 10 + 25 + 50 + >=100 -
In-stock : 0
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
1
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RELAY GEN PURPOSE DPDT 2A 24V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 25000
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Discrete Semiconductor Modules
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2419
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Triac & SCR Output Optocouplers 1.0A Load Current Power Phototriac
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 13453
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Isolated and Regulated 3 WATT Modular DC/DC Converters
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
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Electromechanical
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 100
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 235
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Communications relay
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 110
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Connectors
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1200
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General Purpose Relays
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
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PCB relays Twin relays
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
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Signal Relays
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 290
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 20
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 60000
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 202
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 322
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8-pin plug
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1200
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High Capacity High Breakdown Voltage, 2 Form C, 2A 30VDC, PC Board Terminal Type, 2 Coil Latching, Gold Contact,Low Signal Relays - PCB 2A 5VDC DPDT 2 COIL LATCH PCB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 208
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Relays
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 25000
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High Capacity High Breakdown Voltage, 2 Form C, 2A 30VDC, PC Board Terminal Type, 2 Coil Latching, Gold Contact,Low Signal Relays - PCB 2A 12VDC DPDT 2 COIL LATCH PCB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10000
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ATTEN, VAR, 6DB, -.009TCA, SMD3
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 440
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3000
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 12
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Low Profile Signal relay, 2 Form C, 2A 30VDC, SMD SA Type, 1 Coil Latching, Gold Contact,Low Signal Relays - PCB 2 Form C 3V 2A 30VDC SMD SA Typ1
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 208
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Relays
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5000
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Relays
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1350
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Low Profile Signal relay, 2 Form C, 1 Form A 30VDC, PC Board Terminal Type, 2 Coil Latching, Gold Contact
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 208
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Low Profile Signal relay, 2 Form C, 1 Form A 30VDC, PC Board Terminal Type, 2 Coil Latching, Gold Contact,Low Signal Relays - PCB 1A 12VDC DPDT 2 COIL LATCHING PCB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 208
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Connectors
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5000
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 12000
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Low Profile Signal relay, 2 Form C, 1 Form A 30VDC, PC Board Terminal Type, Gold Contact,Low Signal Relays - PCB 1A 9VDC DPDT NON-LATCHING PCB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 208
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RELAIS HOCHEMPFINDLICH
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 20000
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LOW PROFILE 2 FORM C RELAY
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 25000
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Low Signal Relays - PCB 1A 5VDC DPDT NON-LATCHING PCB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 25000
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Low Signal Relays - PCB 1A 3VDC DPDT NON-LATCHING PCB
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 15200
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Relays
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 54
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Low Profile Signal relay, 2 Form C, 1 Form A 30VDC, PC Board Terminal Type, Gold Contact
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 100000
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Texas Instruments(TI)
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1 + 10 + 25 + 50 + >=100 -
1
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AC/DC Switching Converters Int Off-Line Switchr 15-29W PK 25-43W PK
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5470
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Q:What defines the physical structure of DIP-10?
A:Key features include:
- Through-hole mounting: Standard dual in-line pins for robust PCB attachment.
- 10-pin layout: Symmetrical dual-row arrangement (2×5 pins).
- Wide body design: Typically 12.7 mm × 7.62 mm footprint for stability.
- Thickness: ~3.3 mm body height for compatibility with sockets. -
Q:Why choose DIP-10 over alternatives?
A:Critical advantages:
- Ease of prototyping: Hand-solderable pins simplify development.
- Mechanical durability: Reinforced epoxy body resists vibration/shock.
- Cost-effective: Lower tooling costs vs. SMD packages for low-volume production.
- Legacy compatibility: Direct replacement for older through-hole designs. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 12.7 × 7.62 mm (standard DIP spacing).
- Pin Pitch: 2.54 mm (100 mil) between pins.
- Material: Tin-plated copper alloy leads, epoxy resin body.
- Temp Range: -40°C to +85°C (industrial grade). -
Q:Where is DIP-10 typically applied?
A:Dominant use cases:
- Legacy electronics: Industrial control systems (e.g., PLC modules).
- Educational kits: Breadboard-friendly ICs (e.g., ATmega328P in DIP).
- Low-frequency analog circuits: Op-amps, voltage regulators (e.g., LM741). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 1.0–1.6 mm hole diameter for pin insertion.
- Soldering: Wave soldering preferred; hand-solder at ≤ 300°C.
- Cleaning: Flux removal required for high-reliability applications.
- Inspection: Visual check for pin alignment and solder fillets.