ALL CATEGORIESDFN-3L(1x0.6)
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CJBA3139K
Manufacturer: Jiangsu Changjing Electronics Technology Co., Ltd.
Package/Case: DFN-3L(1x0.6)
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20V 660mA 1.1V P Channel DFN-3L(1x0.6) MOSFETs ROHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 7379
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20V 660mA 650mΩ@4.5V,0.15A 150mW 650mV@250uA P Channel DFN-3L(1x0.6) MOSFETs ROHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4447
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DFN-3L(1x0.6) MOSFETs ROHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5145
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20V 800mA 20V null DFN-3L(1x0.6) MOSFETs ROHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4301
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CJBA3134K
Manufacturer: Jiangsu Changjing Electronics Technology Co., Ltd.
Package/Case: DFN-3L(1x0.6)
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20V 750mA 500mΩ@4.5V,150mA 100mW 1.1V N Channel DFN-3L(1x0.6) MOSFETs ROHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6312
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20V 750mA 250mΩ@4.5V,0.5A 150mW 650mV@250uA DFN-3L(1x0.6) MOSFETs ROHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2082
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60V 300mA 4Ω@4.5V,0.3A 300mW 2.5V@250uA null DFN-3L(1x0.6) MOSFETs ROHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2616
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20V 800mA 350mW 300mΩ@4.5V,0.6A 1.1V@250uA null DFN-3L(1x0.6) MOSFETs ROHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6028
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20V 2A 20V null DFN-3L(1x0.6) MOSFETs ROHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 7671
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20V 600mA 20V P Channel DFN-3L(1x0.6) MOSFETs ROHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6525
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CJBA7002K
Manufacturer: Jiangsu Changjing Electronics Technology Co., Ltd.
Package/Case: DFN-3L(1x0.6)
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60V 410mA 1.2Ω@10V 100mW 2.3V N Channel DFN-3L(1x0.6) MOSFETs ROHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2232
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60V 300mA 1.9Ω 20V null DFN-3L(1x0.6) MOSFETs ROHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5056
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CJBB3139K
Manufacturer: Jiangsu Changjing Electronics Technology Co., Ltd.
Package/Case: DFN-3L(1x0.6)
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20V 660mA 100mW 520mΩ@4.5V,1A 1.1V P Channel DFN-3L(1x0.6) MOSFETs ROHS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 7393
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DFN-3L(1x0.6) MOSFETs ROHS
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6268
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DFN-3L(1x0.6) MOSFETs ROHS
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10972
-
-
DFN-3L(1x0.6) MOSFETs ROHS
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8827
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Q:What defines the physical structure of DFN-3L(1x0.6)?
A:Key features include:
- Leadless bottom-mounted pads for direct PCB attachment.
- Compact 3-pin layout with linear alignment.
- Ultra-thin profile: 0.6 mm body height.
- Minimal footprint: 1.0 × 0.6 mm body size. -
Q:Why choose DFN-3L(1x0.6) over alternatives?
A:Critical advantages:
- Miniaturization: 50% smaller than SOT-23 packages.
- Thermal Performance: Efficient heat dissipation via exposed pad (if applicable).
- Electrical Benefits: Low-inductance design for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 rated). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 1.0 × 0.6 mm.
- Height: 0.6 mm.
- Pin Pitch: 0.35 mm (typical).
- Material: Copper-alloy terminals with Ni/Pd/Au plating.
- Temp Range: -40°C to +125°C. -
Q:Where is DFN-3L(1x0.6) typically applied?
A:Dominant use cases:
- Portable Electronics: Wearables (e.g., heart rate sensors).
- Power Management: Load switches (e.g., TPS22916).
- IoT Modules: Ultra-compact wireless transceivers. -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Thermal vias under pad (if present) for heat dissipation.
- Solder Paste: Type 4 or finer for precise deposition.
- Reflow Profile: Peak temperature ≤ 245°C (JEDEC J-STD-020 compliant).
- Inspection: X-ray (AXI) recommended for pad solder joint verification.