DFN-14
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
-
-
Fuel Gauge Li+/LiFePO4 1-Cell 2-Wire Interface 5.1uA 0.4V 14-Pin TDFN-EP T/R - Tape and Reel
-
1 + 10 + 25 + 50 + >=100 -
In-stock : 1
-
-
Digital to Analog Converters - DAC 8-Bit SPI Octal DAC (2.5V ref, Reset to Zero-Scale)
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 639
-
-
USB Power Manager With Ideal Diode Controller And 3.95V Li-Ion Charger
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3895
-
-
DC/DC Switching Converters Buck-Boost DC-DC Con 0.7A output
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6000
-
-
DC/DC Switching Converters DC-DC Boost Conv 1A output
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 359
-
-
Conv DC-DC 4V to 18V Step Down Single-Out 18V 2A 24W Automotive 14-Pin DFN EP T/R
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1838
-
-
125mA 1x/1.5x Charge Pumps for 5 White LEDs in 3mm x 3mm TDFN
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 266
-
-
Low VBATT, 20uA IQ, 1MHz Synchronous Boost Converter with True Shutdown
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 574
-
-
High-Efficiency, 26V Step-Up Converters for Main and Subdisplays Using OLEDs and/or White LEDs
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 257
-
-
High-Efficiency, 26V Step-Up Converters for Main and Subdisplays Using OLEDs and/or White LEDs
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 233
-
-
PWM Boost Converter for 1.5A White LED Camera Flash
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 182
-
-
±.15kV ESD-Protected.1µ.A.16Mbps.Dual/Quad Low-Voltage Level Translators in UCSP
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 221
-
-
ESD-Protected, 1μA, 16Mbps, Quad Low-Voltage Level Translator
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 211
-
-
Low-Power Battery Backup Circuits in Small レDFN Packages
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 49
-
-
Low-Cost, Small, 4.5V to 28V Wide Operating Range, DC-DC Synchronou...
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5850
-
-
Hot Swap Controller 1CH 80V N-Channel Positive High Voltage Automotive 14Pin DFN EP T/R
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 300
-
-
Hot Swap Controller 1CH 80V N-Channel Positive High Voltage Automotive 14Pin DFN EP Tube
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 310
-
-
Hot Swap Controller 1CH 80V N-Channel Positive High Voltage Automotive 14Pin DFN EP T/R
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4509
-
-
Positive High Voltage Ideal Diode-OR with Input Supply and Fuse Monit...
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 34
-
-
Power Over Ethernet (POE) Controller, 48 V/1 mA, 110 Hz Switch/Clock, 31 V UVLO Threshold, DFN-14
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 90
-
-
IEEE 802.3af Compliant PSE Controller with Internal Switch
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 31
-
-
Battery Powered Applications 4.35V to 5.5V 14-Pin DFN EP Tube
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1662
-
-
USB Power Manager with Ideal Diode Controller and Li-Ion Charger; Package: DFN; No of Pins: 14; Temperature Range: -40°C to +125°C
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1367
-
Q:What defines the physical structure of DFN-14?
A:Key features include:
- Leadless bottom-mounted pads for direct PCB attachment.
- Central thermal pad (70% coverage) for enhanced heat dissipation.
- 14-pin layout with dual-row perimeter arrangement.
- 0.8 mm ultra-thin profile for space-constrained designs. -
Q:Why choose DFN-14 over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller than SOIC-14.
- Thermal Performance: Direct PCB heat path via exposed pad.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-frequency apps.
- Reliability: Moisture-resistant (MSL3) substrate. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 3.0×3.0 mm.
- Height: 0.8 mm.
- Pin Pitch: 0.5 mm.
- Material: Copper-alloy leads with Ni/Pd/Au plating.
- Temp Range: -40°C to +125°C. -
Q:Where is DFN-14 typically applied?
A:Dominant use cases:
- Power Converters: e.g., Buck regulators (TPS62130).
- RF Modules: e.g., Bluetooth/Wi-Fi transceivers (NRF52840).
- Sensor Interfaces: e.g., MEMS accelerometers (LIS2DH). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Thermal vias (4×4 array) under central pad.
- Solder Paste: Type 4 (20–38 µm particle size).
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for pad alignment.



ALL CATEGORIES