ALL CATEGORIESDC DC
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
-
-
Module
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 78
-
-
Transient Voltage Suppressor Diodes
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5689
-
-
Module
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 500
-
-
VDSL FILTER SOLUTIONS
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 22
-
-
CONVERTER MOD DC/DC 28V 25W
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 11
-
-
DC/DC: 48V-15V-100W
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 91
-
-
Module
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2680
-
-
Module
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 300
-
-
Module
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2560
-
-
Module
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1365
-
-
Module
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3000
-
-
IGBT MODULE
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5000
-
-
Module
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3500
-
-
Module
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 106
-
-
Module
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5444
-
-
Module
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 13
-
-
DC to DC Converter
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 106
-
-
Module
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 15
-
-
Module
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 211
-
-
ECONOLINE: REC20-S_D_TRWB(Z)/H - 20W 2???x 2??? Package (50.8x11.40x50.8mm) - 1.6kVDC Isolation - Wide Input 2:1 & 4:1 - Regulated Output - UL94V-0 Package Material - Continuous Short Circuit Protection - Vout Trim and ON/OFF Control Function - Effic
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 100
-
-
Linear and Switching Power Supplies CONV AC/DC 1W 90-277VACin 3.3VOUT
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 100
-
-
DC/DC: 48V-2.5V-125W
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 7000
-
-
Module
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 28
-
-
DC/DC: 300V-5V-150W
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1723
-
-
DC-to-DC Voltage Converter
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6600
-
-
DC/DC Converters 18-36Vin 5 Vout 6.6A Neg TH Pin 3.68mm
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 100
-
-
Analog IC
-
1 + 10 + 25 + 50 + >=100 -
1
-
-
DC-to-DC Voltage Converter
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
-
-
End of life (EOL) for certain part numbers with little or no activity
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 12
-
-
75 Vdc Input Maximum, 10 A Maximum
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5444
-
-
Delphi Series E48SR, 66W Eighth Brick Family DC/DC Power Modules: 48V in, 15V/4A out
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 45
-
-
Isolated DC/DC Converters Board mount DC/DC (88-370DC IN)
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6500
-
-
Other Passive Components
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 15686
-
-
Module
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 12773
-
-
Rad-hard quad 2-input OR gate
-
1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 201
-
Q:What defines the physical structure of DFN-8?
A:Key features include:
- Leadless bottom-mounted pads for compact PCB attachment.
- Central thermal pad (80% coverage) for enhanced heat dissipation.
- 8-pin layout with dual-row symmetrical arrangement.
- 0.8 mm ultra-thin profile for space-constrained designs. -
Q:Why choose DFN-8 over alternatives?
A:Critical advantages:
- Miniaturization: 50% smaller than SOIC-8.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 20%.
- Electrical Benefits: Low-inductance design (<1 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 rating). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 3×3 mm.
- Height: 0.8 mm.
- Pin Pitch: 0.5 mm.
- Material: Copper-alloy leads with Ni/Pd/Au plating.
- Temp Range: -40°C to +125°C. -
Q:Where is DFN-8 typically applied?
A:Dominant use cases:
- Power Converters: Buck/boost ICs (e.g., TPS62825).
- RF Modules: Low-noise amplifiers (e.g., SKY67100).
- Sensor Interfaces: IoT edge devices (e.g., BME280). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal vias under pad (0.3 mm diameter).
- Solder Paste: Type 4 solder recommended for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection.