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DC04
DC04
The DC04 (Full Name) is a surface-mount package designed for high-density circuits. Featuring a compact form factor, lead-free design, and integrated thermal pad, it delivers minimized footprint, superior heat dissipation, and enhanced electrical stability. Typical dimensions are 4×4×1.2 mm with a 0.5 mm pin pitch, making it ideal for portable consumer electronics, automotive power modules, and IoT sensors. Its bottom-terminal contacts enable direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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RES 18.7-OHM 1% 0.10W 100PPM THK-FILM SMD-0603 TR-7-PA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 25000
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RES 1.3K-OHM 1% 0.10W 100PPM THK-FILM SMD-0603 TR-7-PA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 170000
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RES 105K-OHM 1% 0.10W 100PPM THK-FILM SMD-0603 TR-7-PA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 25000
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RES 2.2M-OHM 5% 0.063W -400+150PPM THK-FILM SMD-0402 TR-7-PA2MM UNMARKED
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 150000
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RES 18K-OHM 5% 0.063W 200PPM THK-FILM SMD-0402 TR-7-PA2MM UNMARKED
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 140000
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RES 1.5M-OHM 5% 0.063W -400+150PPM THK-FILM SMD-0402 TR-7-PA2MM UNMARKED
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 150000
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DF04S - BRIDGE RECTIFIER
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1500
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RST SM 0603 33R 5%
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 33456
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MoBL® 8-Mbit (512K x 16) Static RAM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2000
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Side Actuated DIP Switcehs
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2000
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TRANS PREBIAS NPN 0.2W SOT23-3
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 12000
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Npn Silicon Digital Transistor Array
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 135000
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SOT-223 NPN 20V 1A
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 573
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INDUCTOR, 0805 CASE, 18NH; Inductor type:High Frequency / RF; Inductance:18nH; Tolerance, inductance:5%; Resistance:0.07R; Current, DC max:670mA; Frequency, resonant:3300MHz; Case style:0805; Q factor:45; Material, core:Ceramic; RoHS Compliant: Yes
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 82000
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Inductor General Purpose Chip Drum Core 8.2mH 10% 252KHz 30Q-Factor Ferrite 28mA 100Ohm DCR 2220 Automotive T/R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 376700
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Fixed Inductors 470uH 170mA 7.9ohms
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 100000
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CU Series 300V 230Vrms 595V Clamp 400A 60pF SMT Ceramic Disk Varistor
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 637
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Other Passive Components
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 12000
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CN Series 38V 30Vrms 77V Clamp 80A 200pF SMT Ceramic Multilayer Varistor
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8000
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Other Passive Components
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 40000
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Other Passive Components
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 24000
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Other Passive Components
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 28000
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VARISTOR, 9.0J, 30VAC; Series:StandarD; Voltage rating, AC:30V; Suppressor type:Varistors; Voltage rating, DC:38V; Current, Peak Pulse IPP @ 8/20uS:1000A; Voltage, clamping 8/20us max:93V; Energy, transient 10/1000us max:9J; RoHS Compliant: Yes
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10000
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SpeedPower, Low ESR
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 20000
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Other Passive Components
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 40000
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RESONATOR, 433.92MHZ 75KHZ ; FREQUENCY, RESONANT:433.92MHZ; TOLERANCE, :0.017%; TOLERANCE, -:0.017%; CASE STYLE:QCC8C; TEMP, OP. MAX:120(DEGREE C); TEMP, OP. MIN:-45(DEGREE C); ATTENUATION:1.0DB; DEPTH, EXTERNAL:5.0MM; RoHS Compliant: Yes,Filters QCC8C Resonatoren
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10000
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Other Passive Components
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 4000
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Cap Film 0.22uF 100V PET 10% (10 X 3 X 8mm) Radial 7.5mm 125
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 80000
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
1
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Analog Devices,Inc.(AD)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2000
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Other Passive Components
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 825
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Fuses 250V UL FA SL 4A TR5
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 26800
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Fuses IEC TL LBC SL .100A TR5
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 680
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300mA LDO Linear Regulators with Internal Microprocessor Reset Circuit
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 25800
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Other Passive Components
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 15000
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Other Passive Components
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 960
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Fuses 125V FA SL .200A TR3
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 26800
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Low-Power, Single-/Dual-Level Battery Monitors with Hysteresis and Integrated μP Reset,Fuses FUSE 125V FA TR3 SL .200A
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 400
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Optoelectronics
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1905
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Tantalum Capacitor, Polarized, Tantalum (dry/solid), 20V, 10% +Tol, 10% -Tol, 4.7uF, Surface Mount, 2412
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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128 Bit I 2 C? Bus Serial EEPROM
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1 + 10 + 25 + 50 + >=100 -
1
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Conformal coated capacitor
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 32500
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Fuses U 576-0215002.HXP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 63000
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24-20 AWG Gold Plating Crimp Termination Pin Multimate Type III+ Connector
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10639
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Connectors HDR 3.5MM 8POS 90 ORG
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 19800
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Connectors HDR 3.5MM 7POS 90 ORG
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
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CONN,HEADER,4PIN,DISK POWER
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1985
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6 Position Terminal Block Header, Male Pins, Shrouded (4 Side) 0.200" (5.08mm) 90°, Right Angle Through Hole
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2774
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CONN 64POS MALE PROW A+C
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 250
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DIN 41612 Connectors 96P MALE RA TYPE C 2.54MM STANDARD
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8000
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Q:What defines the physical structure of DC04?
A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad (80% coverage): Optimizes heat dissipation.
- 16-pin layout with dual-row arrangement: Balances pin density and routing flexibility.
- 0.8 mm ultra-thin profile: Ideal for space-constrained designs. -
Q:Why choose DC04 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller than SOP-8 packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 15%.
- Electrical Benefits: Low-inductance design (<1 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 rating). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 3.0 × 3.0 mm
- Height: 0.8 mm
- Pin Pitch: 0.5 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C -
Q:Where is DC04 typically applied?
A:Dominant use cases:
- Power Converters: Buck/boost ICs (e.g., TPS62130).
- RF Modules: Bluetooth/Wi-Fi transceivers (e.g., CC2652R).
- Sensor Interfaces: MEMS accelerometers (e.g., LIS2DH12). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal vias under the central pad (0.3 mm diameter).
- Solder Paste: Type 4 solder recommended for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection.