D2PAK

Q:What defines the physical structure of D2PAK?

A:Key features include:
- Leaded design: Exposed metal tabs for mechanical stability.
- Central thermal pad: Large die-attach area (~60% coverage) for heat dissipation.
- 3-pin layout: Standard configuration with gull-wing leads.
- Robust profile: 4.5 mm typical height for power handling.

Q:Why choose D2PAK over alternatives?

A:Critical advantages:
- Power handling: Supports high-current applications (up to 50A).
- Thermal Performance: Direct PCB heat sinking via thermal pad.
- Electrical Benefits: Low-resistance leads for reduced conduction losses.
- Reliability: Molded epoxy body resists mechanical stress.

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 10.0 × 9.5 mm (TO-263 variant).
- Height: 4.5 mm (max).
- Pin Pitch: 2.54 mm (standard).
- Material: Copper-alloy leads with Sn-plating.
- Temp Range: -55°C to +150°C (operational).

Q:Where is D2PAK typically applied?

A:Dominant use cases:
- Power electronics: Voltage regulators (e.g., LM317), motor drivers.
- Automotive systems: ECU power modules (e.g., Infineon TLE4274).
- Industrial equipment: High-current switching (e.g., MOSFETs like IRF540N).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: Thermal vias under pad (≥6 vias recommended).
- Solder Paste: Type 3 or 4 for void control.
- Reflow Profile: Peak temp ≤ 250°C (Pb-free process).
- Inspection: Visual + AXI for lead coplanarity and solder voids.