ALL CATEGORIESCLCC-68
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 37
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16-Bit Microprocessor
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 101
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High Integration 16-Bit Microprocessor iAPX86 Family
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 6
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Micropower Precision Series Reference Family; Package: SOT; No of Pins: 3; Temperature Range: 0°C to +70°C,Microcontrollers (MCU) 32KB 902 RAM 66 I/O
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1550
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IC-SM-8-BIT MCU,Microcontrollers (MCU) 32KB 902 RAM 50 I/O
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 310
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Dual Channel, 12-Bit, 80 MSPS A/D Converter with Analog Input Signal Conditioning
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
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Dual Channel, 12-Bit, 80 MSPS A/D Converter with Analog Input Signal Conditioning
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
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Dual Channel, 14-Bit, 65 MSPS A/D Converter With Analog Input Signal Conditioning; Package: CERAMIC LCC GULL WING; No of Pins: 68; Temperature Range: Industrial
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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Circular Connector; No. of Contacts:8; Series:LJTPQ00R; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:13; Circular Contact Gender:Socket; Circular Shell Style:Wall Mount Receptacle
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2
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Circular Connector; No. of Contacts:8; Series:LJTPQ00R; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:13; Circular Contact Gender:Pin; Circular Shell Style:Wall Mount Receptacle; Insert Arrangement:13-8
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 26
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Circular Connector; MIL SPEC:MIL-DTL-38999 Series I; Body Material:Metal; Series:LJT; No. of Contacts:3; Connector Shell Size:13; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight RoHS Compliant: No
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 279
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Dual Channel, 12-Bit 105 MSPS IF Sampling A/D Converter with Analog Input Signal Conditioning
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 13
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Dual Channel, 14-Bit, 65 MSPS A/D Converter With Analog Input Signal Conditioning; Package: CERAMIC LCC GULL WING; No of Pins: 68; Temperature Range: Industrial
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1023
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Dual Channel, 12-Bit 105 MSPS IF Sampling A/D Converter with Analog Input Signal Conditioning
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 500
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Dual Channel, 12-Bit 105 MSPS IF Sampling A/D Converter with Analog Input Signal Conditioning
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 24
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Dual, 12-Bit, 40 MSPS MCM A/D Converter with Analog Input Signal Conditioning
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
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Q:What defines the physical structure of CLCC-68?
A:Key features include:
- Leadless ceramic body: Bottom-mounted pads for direct PCB attachment.
- Integrated thermal pad: Central exposed pad (80% coverage) for heat dissipation.
- High-density layout: 68-pin configuration with perimeter array arrangement.
- Compact profile: Ultra-thin 1.4 mm height for space-constrained designs. -
Q:Why choose CLCC-68 over alternatives?
A:Critical advantages:
- Miniaturization: 35% smaller footprint than equivalent PLCC packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 20%.
- Electrical Benefits: Low-inductance (<1 nH) design for high-frequency stability.
- Reliability: Hermetic ceramic substrate resists moisture and chemical corrosion. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 10.0 × 10.0 mm
- Height: 1.4 mm
- Pin Pitch: 0.5 mm
- Material: Alumina ceramic body with gold-plated contacts.
- Temp Range: -55°C to +150°C (military-grade tolerance). -
Q:Where is CLCC-68 typically applied?
A:Dominant use cases:
- Aerospace: Radar signal processors (e.g., X-band transceivers).
- Medical: Implantable device controllers (e.g., pacemaker ICs).
- Telecom: 5G RF front-end modules (e.g., mmWave power amplifiers). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Use 4×4 thermal via arrays under the central pad (0.3 mm diameter).
- Solder Paste: Type 4 (5–15 µm particle size) for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 250°C (ceramic-sensitive ramp rates).
- Inspection: X-ray (AXI) mandatory for joint integrity verification.