ALL CATEGORIESCDIP-16P
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Integrated Circuits (ICs)
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Integrated Circuits (ICs)
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Integrated Circuits (ICs)
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Integrated Circuits (ICs)
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Samsung Semiconductor, Inc.
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Integrated Circuits (ICs)
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4-Channel Analog Multiplexer
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+15V/-15V Wide Analog Signal Range, High Current Capability 80mA (Typical)
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Integrated Circuits (ICs)
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Analog Switch
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Multiconductor Cable; Number of Conductors:2; Conductor Size AWG:18; No. Strands x Strand Size:Solid; Jacket Material:Polyvinylchloride (PVC); Leaded Process Compatible:Yes; Approval Bodies:NEC; Conductor Material:Copper RoHS Compliant: Yes
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SINGLE 16 AND 8/ DIFFERENTIAL 8 CHANNEL AND 4 CHANNEL CMOS ANALOG MULTIPLEXERS
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Look-Ahead Carry Generator
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Integrated Circuits (ICs)
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Integrated Circuits (ICs)
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Wideband Four Quadrant Analog Multiplier (Voltage Output)
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Integrated Circuits (ICs)
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Integrated Circuits (ICs)
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Line Receiver
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Magnitude Comparator
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JT 41C 41#20 PIN PLUG
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Quad SPST CMOS Analog Switches
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Integrated Circuits (ICs)
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Integrated Circuits (ICs)
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Integrated Circuits (ICs)
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Integrated Circuits (ICs)
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Integrated Circuits (ICs)
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Minimum : 1 In-stock : 215
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Integrated Circuits (ICs)
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Resistor Networks & Arrays 330 ohm 2% 16 Pin Bussed
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Minimum : 1 In-stock : 208
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Motorola Semiconductor
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Integrated Circuits (ICs)
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Minimum : 1 In-stock : 279
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Motorola Semiconductor
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Minimum : 1 In-stock : 314
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Motorola Semiconductor
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Minimum : 1 In-stock : 1006
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Motorola Semiconductor
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Motorola Semiconductor
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Minimum : 1 In-stock : 248
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Motorola Semiconductor
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Minimum : 1 In-stock : 432
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Q:What defines the physical structure of CDIP-16P?
A:Key features include:
- 16-pin layout with dual in-line (DIP) arrangement
- Ceramic body for high-temperature resilience
- Leaded design with through-hole mounting capability
- Standard thickness: ~4.32 mm (typical) -
Q:Why choose CDIP-16P over alternatives?
A:Critical advantages:
- Robustness: Hermetic ceramic sealing (moisture- and corrosion-resistant)
- Thermal Performance: Superior heat dissipation vs. plastic DIP packages
- Electrical Isolation: Low parasitic capacitance for high-frequency stability
- Reliability: MIL-STD-883 compliance for harsh environments -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 19.94 × 7.87 mm (nominal)
- Height: 4.32 mm (max)
- Pin Pitch: 2.54 mm (standard DIP spacing)
- Material: Ceramic body with Kovar or alloy leads
- Temp Range: -55°C to +125°C (military-grade) -
Q:Where is CDIP-16P typically applied?
A:Dominant use cases:
- Aerospace/Defense: Radar systems (e.g., RF amplifiers)
- Industrial Controls: High-reliability PLC modules
- Telecom: Base station power management ICs -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Reinforced through-holes for mechanical stress relief
- Soldering: Wave soldering preferred (leaded process)
- Cleaning: Avoid ultrasonic cleaning to prevent ceramic cracking
- Inspection: Visual inspection for lead coplanarity (≤ 0.1 mm deviation)