ALL CATEGORIESCAN-4
- Picture & Models
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Discrete Semiconductors
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In-stock : 0
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In-stock : 0
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R.F. AND SWITCHING TRANSISTORS N-P-N, HF. UND SCHALTTRANSISTOREN N-P-N
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1 + 10 + 25 + 50 + >=100 -
In-stock : 0
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N/A
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1 + 10 + 25 + 50 + >=100 -
In-stock : 0
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Varactor-Tuned Oscillators
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10
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OSC 3.3V SMT 7X5 CMOS
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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1.0 GHz SILICON MMIC AMPLIFIER
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 208
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Transistors
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 100
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Discrete Semiconductors
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
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Discrete Semiconductors
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 27
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4-Terminal Adjustable Voltage Regulators
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
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N/A
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 9600
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RF AMPLIFIER MODEL
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 320
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Discrete Semiconductors
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2500
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Air Quality Sensor
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2000
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Transistors
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
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Detection of Carbon Monoxide
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2027
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 550
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Motorola Semiconductor
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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Motorola Semiconductor
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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SWITCHING REGULATOR POWER OUTPUT STAGES
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Minimum : 1 In-stock : 208
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Other Passive Components
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 225
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Transistors
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 208
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HIGH SPEED DMOS FET ANALOG SWITCHES AND SWITCH ARRAYS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 500
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Semiconductor Devices, Silicon hybrid Switching Regulators High Reliability Types
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 208
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Power Integrated Circuit; Package: TO-66; IO (A): 10; I in/I out (V): 100;
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Minimum : 1 In-stock : 90
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Power Integrated Circuit; Package: TO-66; IO (A): 15; I in/I out (V): 100;
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Minimum : 1 In-stock : 10000
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Output Current:250mA, Propagation Delay:625ns, Supply Voltage Min:4.5V, Supply Voltage Max:5.5V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 50
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Silicon NPN Transistor General Purpose Audio Amplifier, Switch
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 208
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TRANSISTOR | BJT | NPN | 18V V(BR)CEO | 100MA I(C) | TO-72
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 208
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Automotive Connectors Automotive USB 2.0, DIP
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5000
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
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(MFExxx) Dual Gate MOSFETs
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Minimum : 1 In-stock : 208
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Discrete Semiconductors
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 208
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N-CHANNEL DUAL GATE SILICON NITRIDE PASSIVATED MOS FIELD EFFECT TRANSISTORS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 208
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N-CHANNEL DUAL GATE SILICON NITRIDE PASSIVATED MOS FIELD EFFECT TRANSISTORS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 208
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Current-Mode SMPS Controller
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Transistors
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 208
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IC
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 676
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4-TERMINAL ADJUSTABLE VOLTAGE REGULATORS
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 208
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LM3911 Temperature Controller
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 52
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
1
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Integrated Circuits (ICs)
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Precision Reference
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Minimum : 1 In-stock : 150
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MIL-SPEC IC 7725 D/C
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 208
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Discrete Semiconductors
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 208
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Voltage-Mode SMPS Controller
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 121
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Sensors, Transducers
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Minimum : 1 In-stock : 38
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Transistors
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 208
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Q:What defines the physical structure of CAN-4?
A:Key features include:
- Leadless bottom-mounted pads for compact PCB integration.
- Central thermal pad (80% coverage) for enhanced heat dissipation.
- 4-pin layout with symmetric quad-flat arrangement.
- 1.0 mm ultra-thin profile for space-constrained designs. -
Q:Why choose CAN-4 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller than SOT-23 packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 15%.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 rating). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 2.5×2.5 mm
- Height: 1.0 mm
- Pin Pitch: 0.65 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C -
Q:Where is CAN-4 typically applied?
A:Dominant use cases:
- Power Converters: Buck/boost ICs (e.g., TPS62130).
- RF Modules: Low-noise amplifiers (e.g., SKY67100).
- Sensor Interfaces: MEMS pressure sensors (e.g., BMP280). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: Thermal vias (4×4 array) under central pad.
- Solder Paste: Type 4 solder recommended for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection.