ALL CATEGORIESBGA-96
- Picture & Models
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- Operation
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Memory
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 500
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MCU 32-bit ARM Cortex M3 RISC 256KB Flash 3.3V 96-Pin CSP-BGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3
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MCU 32Bit ARM Cortex M3 RISC 256KB Flash 3.3V 96Pin CSP-BGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 900
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Amplifier
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 579
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1200
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 200
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IC USB TYPE C CCG5 96BGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10000
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Low Speed USB Type-C and USB PD Controller and Power Switch USB 2.0 3.3V T/R 96-Pin BGA MICROSTAR JUNIOR
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1 + 10 + 25 + 50 + >=100 -
1
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Low Speed USB Type-C and USB PD Controller and Power Switch USB 2.0 3.3V T/R 96-Pin BGA MICROSTAR JUNIOR
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1 + 10 + 25 + 50 + >=100 -
1
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USB Type-C™ and USB PD Controller Power Switch and High-Speed Multiplexer
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1 + 10 + 25 + 50 + >=100 -
1
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DRAM Chip DDR4 SDRAM 8Gbit 512Mx16 1.2V 96-Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 100
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1GBIT DDRIII DRAM
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 160
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SDRAM, 256M x 16bit, 2048Byte, 1.07ns, Parallel Interface, FBGA-96
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 26000
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DDR3 128Mx16 PC2133
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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DRAM Chip DDR3L SDRAM 4Gbit 256Mx16 1.35V Automotive 96-Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1913
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DRAM Chip DDR3L SDRAM 4G-Bit 256M x 16 1.35V 96-Pin F-BGA (
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3000
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Communication & Networking ICs
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1 + 10 + 25 + 50 + >=100 -
In-stock : 0
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IC SDRAM 8GBIT 1.2GHZ 96BGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 8000
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DDR3 128Mx16 PC1600
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1181
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DDR3 256Mx16 PC1600
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1280
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Chip SDRAM 4GBIT 1.6GHZ 96 BGA
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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DDR3 256Mx16 PC1600
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5000
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IC BUS TRANSCVR 16BIT
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1 + 10 + 25 + 50 + >=100 -
1
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12-bit, 25 MSPS 1-Channel AFE for CCD Sensors with Fixed TG 96-BGA MICROSTAR JUNIOR -40 to 85,Video ICs 12B 25Msps CCD Sig Proc
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1 + 10 + 25 + 50 + >=100 -
1
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Telecom Line Management ICs 2CH 14B 36 Msps CCD Signal Processor
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1 + 10 + 25 + 50 + >=100 -
1
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 13
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Buffers & Line Drivers Mil Enh 3.3V ABT 32B Bfr/Drvr
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1 + 10 + 25 + 50 + >=100 -
1
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Dual Output 13-Bit Register with SSTL-2 Compatible I/O and Reset; Package: BGA; No of Pins: 96; Container: Tape & Reel,Registers 13-Bit Register DO SSTL-2 Comp
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 210
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Voltage Regulator IC; Output Current:300mA; Package/Case:8-MSOP; Supply Voltage Max:6V; Current Rating:300mA; Leaded Process Compatible:No; Output Current Max:300mA; Output Voltage Max:5V; Output Voltage Min:1.215V,Registers 13-Bit Register DO SSTL-2 Comp
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 30
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Clock Buffer 1.8V Reg. Buffer (800 MHz)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 270
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26-Bit Registered Buffer with SSTL_2 Inputs and Outputs
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1 + 10 + 25 + 50 + >=100 -
1
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25-Bit Configurable Registered Buffer With Address-Parity Test 96-BGA -40 to 85,Registers 25B Configurable Registered Buffer
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1 + 10 + 25 + 50 + >=100 -
1
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1.5V/1.8V 25-Bit Configurable Registered Buffer With Address-Parity Test 96-BGA -40 to 85,Buffers & Line Drivers 1.5V/1.8V 25B Config Reg Buffer
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1 + 10 + 25 + 50 + >=100 -
1
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32-Bit Buffer/Driver with 3-State Outputs 96-LFBGA -40 to 85,Buffers & Line Drivers 32B Buffer Driver
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1 + 10 + 25 + 50 + >=100 -
1
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32-Bit Transparent D-Type Latch With 3-State Outputs 96-LFBGA -40 to 85,Latches 32bit Transparent
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1 + 10 + 25 + 50 + >=100 -
1
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Circular Connector; No. of Contacts:61; Series:MS27467; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:25; Circular Contact Gender:Pin; Circular Shell Style:Straight Plug; Insert Arrangement:25-61 RoHS Compliant: No
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1 + 10 + 25 + 50 + >=100 -
1
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32-BIT LVTTL-TO-GTLP BUS TRANSCEIVER,Specialty Function Logic 32B LVTTL to GTLPBus Transceiver
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1 + 10 + 25 + 50 + >=100 -
1
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32-BIT LVTTL-TO-GTLP BUS TRANSCEIVER,Bus Transceivers 32bit LVTTL-GTLP
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1 + 10 + 25 + 50 + >=100 -
1
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H8 Family; H8/300L Super Low Power Series; Microcontroller; Bit Size: 8-bit; ROM: 16K; RAM: 1K; ROM Type: Flash memory; CPU: H8/300L core; Minimum Instruction Execution Time (ns): 200 (@10MHz); Operating Frequency / Supply Voltage: 10MHz/2.7 to 5.5V;,Bus Transceivers 32B Dual Supply Bus Transceiver
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1 + 10 + 25 + 50 + >=100 -
1
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32-BIT DUAL-SUPPLY BUS TRANSCEIVER WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTS,Bus Transceivers 32B Dual Supply Bus Trancvr
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1 + 10 + 25 + 50 + >=100 -
1
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32-Bit Dual-Supply Bus Transceiver with Configurable Voltage Translation and 3-State Outputs 96-BGA MICROSTAR JUNIOR -40 to 85,Bus Transceivers 32B Dual-Supply Bus Xceiver
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1 + 10 + 25 + 50 + >=100 -
1
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Analog Multiplexer/ Demultiplexer; Package: TSSOP-16; No of Pins: 16; Container: Tape and Reel; Qty per Container: 2500,Buffers & Line Drivers 32B Bufr Drvr
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1 + 10 + 25 + 50 + >=100 -
1
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32-Bit D-Type Flip-Flops with 3-State Outputs 96-LFBGA -40 to 85,Flip Flops 32B D-Type Flip-Flop
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1 + 10 + 25 + 50 + >=100 -
1
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32-BIT BUFFER/DRIVER WITH 3-STATE OUTPUTS,Buffers & Line Drivers 32B Buffer/Driver
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1 + 10 + 25 + 50 + >=100 -
1
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Integrated Circuits (ICs)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5410
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DDR3 128x16 1600 CL11 96Ball 1.5V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10000
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Q:What defines the physical structure of BGA-96?
A:Key features include:
- Leadless bottom-mounted pads: Ensures reliable solder joints and compact PCB footprint.
- Central thermal pad (10×10 mm coverage): Enhances heat dissipation for high-power applications.
- 96-pin layout with 8×12 grid array: Optimizes pin density and signal routing efficiency.
- 1.2 mm ultra-thin profile: Ideal for space-constrained designs. -
Q:Why choose BGA-96 over alternatives?
A:Critical advantages:
- Miniaturization: 30% smaller footprint than equivalent QFP packages.
- Thermal Performance: Direct PCB heat path via thermal pad reduces junction temperature by up to 15°C.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-speed signals.
- Reliability: Moisture-resistant substrate (MSL-3 rated) for harsh environments. -
Q:What are common technical specs for BGA-96?
A:Standard configurations (consult datasheets):
- Body Size: 12×12 mm
- Height: 1.2 mm
- Pin Pitch: 0.8 mm
- Material: Copper-alloy pads with SnAgCu finish
- Temp Range: -40°C to +125°C (industrial grade) -
Q:Where is BGA-96 typically applied?
A:Dominant use cases:
- Power Converters: High-current voltage regulators (e.g., TI TPS54620).
- RF Modules: 5G/Wi-Fi 6 transceivers (e.g., Qualcomm QCN9024).
- Sensor Interfaces: MEMS-based IoT devices (e.g., Bosch BME688). -
Q:What are critical assembly guidelines for BGA-96?
A:Key recommendations:
- PCB Design: Use 4×4 thermal vias under the central pad (0.3 mm diameter).
- Solder Paste: Type 4 solder (particle size 20–38 μm) for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process recommended).
- Inspection: X-ray (AXI) mandatory to verify hidden solder joints.