BGA-80

Q:What defines the physical structure of BGA-80?

A:Key features include:
- Leadless bottom-mounted pads: Ensures robust PCB attachment.
- Central thermal pad (80% coverage): Enhances heat dissipation.
- 80-pin layout with perimeter array: Optimizes signal routing density.
- 1.2 mm ultra-thin profile: Ideal for space-constrained designs.

Q:Why choose BGA-80 over alternatives?

A:Critical advantages:
- Miniaturization: 40% smaller footprint than equivalent QFP packages.
- Thermal Performance: Direct PCB heat path via thermal pad reduces junction temperature by 25%.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-speed signals.
- Reliability: Moisture-resistant substrate (MSL-3 rated).

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 10×10 mm
- Height: 1.2 mm
- Pin Pitch: 0.8 mm
- Material: Copper-alloy pads with solder mask-defined (SMD) openings.
- Temp Range: -40°C to +125°C (industrial grade).

Q:Where is BGA-80 typically applied?

A:Dominant use cases:
- Power Converters: High-current ICs (e.g., TI TPS54620).
- RF Modules: 5G/Wi-Fi FEMs (e.g., Qorvo QPF4526).
- Sensor Interfaces: MEMS arrays (e.g., Bosch BMI270).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: 4×4 thermal via array under central pad (0.3 mm diameter).
- Solder Paste: Type 4 solder (5–15 µm particle size).
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<15% tolerance).