ALL CATEGORIESBGA-676
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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FPGA, Kintex-7, MMCM, PLL, 250 I/O's, 741 MHz, 162240 Cells, 970 mV to 1.03 V, FCBGA-676
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 300
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Dual ARM? Cortex?-A9 MPCore? with CoreSight? System On Chip (SOC) IC Zynq?-7000 Kintex?-7 FPGA, 125K Logic Cells 256KB 800MHz 676-FCBGA (27x27)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
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Kintex-7 FPGA 400 I/O 676FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 210
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Interface ICs
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 180
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FPGA, Kintex-7, MMCM, PLL, 400 I/O's, 625 MHz, 162240 Cells, 970 mV to 1.03 V, FCBGA-676
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 418
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FPGA Spartan?-6 LXT Family 74637 Cells 45nm (CMOS) Technology 1.2V 676-Pin FBGA - T02
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 39
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FPGA Artix-7 Family 101440 Cells 28nm Technology 1V 676Pin BGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 108
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Field Programmable Gate Arrays
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 13
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Field Programmable Gate Arrays
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10
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Virtex-E 1.8 V Field Programmable Gate Arrays FPGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 25
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Virtex-E 1.8 V Field Programmable Gate Arrays FPGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 12
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FPGA Virtex-E Family 186.624K Gates 15552 Cells 357MHz 0.18um Technology 1.8V 676Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 24
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Virtex-E 1.8 V Extended Memory Field Programmable Gate Arrays
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 210
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560KBITS BRAM 400000 SYSTEM GATES 404 I/ - NOT RECOMMENDED for NEW DESIGN
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 210
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Programmable Logic ICs
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 207
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FPGA Kintex-7 Family 406720 Cells 28nm Technology 1V 676-Pin FCBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2912
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FPGA, Kintex-7, MMCM, PLL, 250 I/O's, 710 MHz, 406720 Cells, 970 mV to 1.03 V, FCBGA-676
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 11
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FPGA Kintex-7 Family 326080 Cells 28nm Technology 1V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3000
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FPGA, Kintex-7, MMCM, PLL, 250 I/O's, 710 MHz, 326080 Cells, 970 mV to 1.03 V, FCBGA-676
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 900
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FPGA Kintex-7 Family 326080 Cells 28nm Technology 1V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 224
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FPGA Kintex-7 Family 162240 Cells 28nm Technology 1V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2000
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FPGA Kintex-7 Family 162240 Cells 28nm Technology 1V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1200
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FPGA Spartan®-6 LXT Family 74637 Cells 45nm (CMOS) Technology 1.2V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 168
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Lead Acid Cylindrical 6V 8Ah E Secondary
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 44
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FPGA Spartan®-6 LXT Family 147443 Cells 45nm (CMOS) Technology 1.2V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5000
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FPGA Spartan®-6 LXT Family 147443 Cells 45nm (CMOS) Technology 1.2V 676Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 223
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FPGA Spartan®-6 LX Family 147443 Cells 45nm (CMOS) Technology 1.2V 676Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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FPGA Spartan®-6 LX Family 147443 Cells 45nm (CMOS) Technology 1.2V 676Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 47
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FPGA Spartan®-6 LXT Family 101261 Cells 45nm (CMOS) Technology 1.2V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 305
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Spartan®-6 LX Family 101261 Cells 45nm (CMOS) Technology 1.2V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 60
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FPGA SPARTAN-6 LX FAMILY 101261 CELLS 45NM (CMOS) TECHNOLOGY - Trays BGA-676
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 100
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FPGA Spartan®-6 LX Family 101261 Cells 45nm (CMOS) Technology 1.2V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 336
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FPGA Virtex-5 LX Family 82944 Cells 65nm (CMOS) Technology 1V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 210
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FPGA Virtex-5 LX Family 82944 Cells 65nm (CMOS) Technology 1V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 210
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FPGA Virtex-5 LX Family 46080 Cells 65nm (CMOS) Technology 1V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10
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Field Programmable Gate Array, 3600 CLBs, 1098MHz, 46080-Cell, CMOS, PBGA676, 27 X 27MM, LEAD FREE, FBGA-676
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 50
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XC5VLX50-1FF676I - NEW PRODUCT
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 210
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FPGA Virtex®-5 LX Family 30720 Cells 65nm (CMOS) Technology 1V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 25
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FPGA Virtex®-5 LX Family 30720 Cells 65nm (CMOS) Technology 1V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 97
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XC5VLX30-1FF676I - NEW PRODUCT
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 210
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XC5VLX30-1FF676C - NEW PRODUCT
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 193
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110592 Cells 65nm (CMOS) Technology 1V
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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FPGA Virtex®-4 FX Family 41904 Cells 90nm (CMOS) Technology 1.2V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 210
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Programmable Logic ICs
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 13
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SPARTAN-3ADSP FPGA 3400K 676FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 49
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SPARTAN-3ADSP FPGA 3400K 676FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 256
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FPGA Spartan-3A DSP Family 1.8M Gates 37440 Cells 770MHz 90nm Technology 1.2V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 174
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1.8M Gates 37440 Cells 667MHz 90nm Technology 1.2V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 363
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Extended Spartan-3A FPGAs, Package: 4FGG676C
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 103
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Family 1.8M Gates 37440 Cells 667MHz 90nm Technology 1.2V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 210
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Q:What defines the physical structure of BGA-676?
A:Key features include:
- Leadless bottom-mounted pads: Ensures robust PCB connectivity without protruding leads.
- Central thermal pad (70% coverage): Enhances heat dissipation for high-power applications.
- 676-pin layout with area-array arrangement: Optimizes I/O density and signal routing.
- 1.2 mm ultra-thin profile: Supports compact designs in space-constrained systems. -
Q:Why choose BGA-676 over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller footprint than equivalent QFP packages.
- Thermal Performance: Direct PCB heat path via thermal vias reduces junction temperature by 25%.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-speed signals.
- Reliability: Moisture-resistant substrate (MSL-3 certified) for harsh environments. -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 27×27 mm
- Height: 1.2 mm
- Pin Pitch: 0.8 mm
- Material: Copper-alloy leads with SnAgCu solder balls.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is BGA-676 typically applied?
A:Dominant use cases:
- High-performance computing: GPU/CPU interposers (e.g., NVIDIA H100).
- 5G RF modules: mmWave beamforming ICs (e.g., Qualcomm QPM56xx).
- Automotive ADAS: Lidar sensor interfaces (e.g., Luminar Iris). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal via array under central pad (0.3mm diameter).
- Solder Paste: Type 4 (20–38 µm particle size) for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<15% tolerance).