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BGA-484
BGA-484
The BGA-484 (Ball Grid Array-484) is a surface-mount package designed for high-density integrated circuits. Featuring a leadless design, a thermal-enhanced bottom, and an ultra-thin profile, it delivers superior thermal dissipation and reduced electrical noise and signal interference. Typical dimensions are 35×35 mm with a 1.0 mm ball pitch and a 1.6 mm maximum height, making it ideal for high-performance processors/chipsets, networking and telecommunications hardware, and advanced embedded systems. Its bottom-terminal ball array enables direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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FPGA Eclipse II Family 320.64K Gates 1536 Cells 0.18um Technology 1.8V 484-Pin BGA
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1 + 10 + 25 + 50 + >=100 -
1
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FPGA SmartFusion2 Family 12084 Cells 65nm Technology 1.2V 484-Pin FPBGA Tray
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 60
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FPGA Kintex-7 Family 162240 Cells 28nm Technology 1V 484Pin Lidless FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 180
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Field Programmable Gate Array, 5831 CLBs, 806MHz, 74637-Cell, CMOS, PBGA484, 23 X 23MM, 1MM PITCH, LEAD FREE, FBGA-484
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 253
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FPGA Zynq?-7000 Family 1.3M Gates 85000 Cells 28nm Technology Automotive 484-Pin CSBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 112
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FPGA SmartFusion2 Family 56340 Cells 65nm Technology 1.2V 484-Pin FBGA Tray
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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Spartan-6 LX FPGA 296 I/O 484FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 12
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FPGA Spartan®-6 LXT Family 43661 Cells 45nm (CMOS) Technology 1.2V 484Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 564
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PHY 1-CH 1000Mbps
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 210
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FPGA Cyclone® V SE Family 25000 Cells 28nm Technology 1.1V 484Pin UFBGA
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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FPGA Kintex-7 Family 65600 Cells 28nm Technology 1V 484Pin Lidless FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 360
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FPGA Artix-7 Family 101440 Cells 28nm Technology 1V 484Pin BGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10000
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FPGA Spartan®-6 LX Family 24051 Cells 45nm (CMOS) Technology 1.2V 484Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 100
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Dual ARM? Cortex?-A9 MPCore? with CoreSight? System On Chip (SOC) IC Zynq?-7000 Artix?-7 FPGA, 85K Logic Cells 256KB 766MHz 484-CSPBGA (19x19)
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 500
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FPGA Spartan®-6 LX Family 74637 Cells 45nm (CMOS) Technology 1.2V 484-Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 199
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FPGA Virtex®-6 LXT Family 74496 Cells 40nm (CMOS) Technology 1V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 60
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FPGA, Artix-7, MMCM, PLL, 285 I/O's, 464 MHz, 215360 Cells, 950 mV to 1.05 V, FCBGA-484
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1000
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PSoC / MPSoC Microprocessor, Zynq-7000 Family, ARM Cortex-A9, 667 MHz, BGA-484
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1635
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FPGA, Kintex-7, MMCM, PLL, 185 I/O's, 710 MHz, 65600 Cells, 970 mV to 1.03 V, FCBGA-484
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 28
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Artix-7 FPGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3120
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FPGA Virtex-6 LXT Family 74496 Cells 40nm (CMOS) Technology 1V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 60
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FPGA Virtex®-6 LXT Family 74496 Cells 40nm (CMOS) Technology 1V 484-Pin FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 229
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FPGA Virtex-6 LXT Family 128000 Cells 40nm (CMOS) Technology 1V 484-Pin FCBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 120
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FPGA Spartan®-6 LXT Family 74637 Cells 45nm (CMOS) Technology 1.2V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 52
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FPGA Spartan®-6 LX Family 74637 Cells 45nm (CMOS) Technology 1.2V 484-Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 201
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Field Programmable Gate Array, 5831 CLBs, 862MHz, 74637-Cell, CMOS, PBGA484, 19 X 19MM, 0.8MM PITCH, LEAD FREE, BGA-484
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10000
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FPGA Spartan-6 LX Family 74637 Cells 45nm
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 420
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FPGA Spartan®-6 LX Family 74637 Cells 45nm (CMOS) Technology 1.2V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 149
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FPGA Spartan®-6 LX Family 74637 Cells 45nm (CMOS) Technology 1.2V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1254
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FPGA Spartan®-6 LXT Family 43661 Cells 45nm (CMOS) Technology 1.2V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 90
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Field Programmable Gate Array, 3411 CLBs, 862MHz, 43661-Cell, CMOS, PBGA484, 23 X 23MM, 1MM PITCH, LEAD FREE, FBGA-484
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1500
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FPGA Spartan®-6 LXT Family 43661 Cells 45nm (CMOS) Technology 1.2V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 511
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FPGA Spartan®-6 LXT Family 43661 Cells 45nm (CMOS) Technology 1.2V 484Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 285
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FPGA Spartan-6 LXT Family 43661 Cells 45nm (CMOS) Technology 1.2V 484Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 18
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Field Programmable Gate Array, 3411 CLBs, 862MHz, 43661-Cell, CMOS, PBGA484, 23 X 23MM, 1MM PITCH, LEAD FREE, FBGA-484
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1200
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FPGA Spartan®-6 LX Family 43661 Cells 45nm (CMOS) Technology 1.2V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3000
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FPGA Spartan®-6 Family 43661 Cells 45nm (CMOS) Technology 1.2V 484Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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FPGA Spartan®-6 LX Family 43661 Cells 45nm (CMOS) Technology 1.2V 484Pin CSBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 420
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FPGA Spartan?-6 LXT Family 147443 Cells 45nm Technology 1.2V 484-Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3
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FPGA Spartan®-6 Family 147443 Cells 45nm (CMOS) Technology 1.2V 484Pin FBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 100
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FPGA Spartan?-6 LX Family 147443 Cells 45nm Technology 1.2V 484-Pin CSBGA
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2000
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IC FPGA 338 I/O
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 50
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Field Programmable Gate Array, 7911 CLBs, 667MHz, 101261-Cell, CMOS, PBGA484, 23 X 23MM, 1MM PITCH, LEAD FREE, FBGA-484
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 212
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FPGA Spartan®-6 LX Family 101261 Cells 45nm (CMOS) Technology 1.2V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 50
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Extended Spartan-3A FPGAs, Package: 4CS484LI
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1 + 10 + 25 + 50 + >=100 -
In-stock : 1
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FPGA Spartan®-3A DSP Family 1.8M Gates 37440 Cells 667MHz 90nm Technology 1.2V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2500
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Extended Spartan-3A FPGAs, Package: 4CSG484C
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 940
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1.8M Gates 37440 Cells 667MHz 90nm Technology 1.2V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 210
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FPGA Spartan-3AN Family 700K Gates 13248 Cells 667MHz 90nm Technology 1.2V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 5000
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FPGA Spartan-3AN Family 700K Gates 13248 Cells 667MHz 90nm Technology 1.2V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 210
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Q:What defines the physical structure of BGA-484?
A:Key features include:
- Leadless bottom-mounted pads: Ensures robust PCB attachment.
- Central thermal pad (70% coverage): Enhances heat dissipation.
- 484-pin layout with staggered array: Optimizes signal routing density.
- 1.2 mm ultra-thin profile: Saves vertical space in compact designs. -
Q:Why choose BGA-484 over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller footprint than equivalent QFP packages.
- Thermal Performance: Direct PCB heat path via thermal pad reduces junction temps by 15°C.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-speed signals.
- Reliability: Moisture-resistant substrate (MSL3 certified). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 23×23 mm.
- Height: 1.2 mm.
- Pin Pitch: 0.8 mm.
- Material: Copper-alloy pads with solder mask-defined (SMD) finish.
- Temp Range: -40°C to +125°C (industrial grade). -
Q:Where is BGA-484 typically applied?
A:Dominant use cases:
- High-performance computing: GPU/CPU power delivery (e.g., NVIDIA T4 modules).
- 5G RF modules: mmWave beamforming ICs (e.g., Qualcomm QPM56xx).
- Automotive ADAS: Lidar sensor interfaces (e.g., Luminar Iris). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal via array under central pad (0.3mm diameter).
- Solder Paste: Type 4 (20–38 µm particle size) for fine-pitch printing.
- Reflow Profile: Ramp rate ≤2°C/s, peak temp ≤245°C (Pb-free).
- Inspection: X-ray (AXI) mandatory for void detection (<15% tolerance).