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BGA 324

The BGA 324 (Ball Grid Array 324) is a surface-mount package designed for high-density circuits. Featuring a leadless design, an exposed thermal pad, and high-density interconnects, it delivers superior heat dissipation and reduced signal interference. Typical dimensions are 15×15 mm with a 0.8 mm pin pitch and a 1.4 mm profile height, making it ideal for high-performance microprocessors, graphics processing units, and networking equipment. Its bottom-terminal contacts enable direct PCB thermal transfer, while RoHS-compliant materials ensure reliability in industrial environments.
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