BGA-168

Q:What defines the physical structure of BGA-168?

A:Key features include:
- Leadless bottom-mounted pads: Ensures direct PCB connectivity without protruding leads.
- Central thermal pad (10×10 mm coverage): Enhances heat dissipation for high-power applications.
- 168-pin layout with 12×14 grid array: Optimizes pin density for complex circuits.
- 1.2 mm ultra-thin profile: Reduces footprint in space-constrained designs.

Q:Why choose BGA-168 over alternatives?

A:Critical advantages:
- Miniaturization: 35% smaller than equivalent QFP packages.
- Thermal Performance: Direct PCB heat path via thermal pad reduces junction temperature by 20%.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-frequency signals.
- Reliability: Moisture-resistant substrate (MSL3 certified) for harsh environments.

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 15×15 mm
- Height: 1.2 mm
- Pin Pitch: 0.8 mm
- Material: Copper-alloy pads with solder mask-defined (SMD) finish.
- Temp Range: -40°C to +125°C (industrial grade).

Q:Where is BGA-168 typically applied?

A:Dominant use cases:
- High-performance CPUs: e.g., Embedded processors (e.g., NXP i.MX8).
- FPGA/ASIC packaging: e.g., Xilinx Artix-7 series.
- Networking hardware: e.g., 100G optical transceivers.

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: 4×4 thermal vias array under the central pad (0.3 mm diameter).
- Solder Paste: Type 4 solder (20–38 μm particle size) for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<15% tolerance).