ALL CATEGORIESAVX/KYOCERA ASIA
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CAP 4-ARRAY 1000PF 100V X7R 0612,Capacitor Arrays & Networks 100volts 1000pF 20% 4cap X7R
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 3000
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VARISTOR METAL-OXIDE 18V 0.015J 475V-CV 1-ELEMENT SMD-0603 SN100 TR-7-PL,Varistors - MLV 18VDC .015J 65V
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 76000
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CAP 0.1UF 50V 10% NP0(C0G) SMD-1210 BULK TIN/LEAD/ALLOY M-MIL-PRF-55681
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 86000
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CAPACITOR, 10PF 2000V NPO 1206CAPACITOR, 10PF 2000V NPO 1206; Capacitance:10pF; Voltage rating, DC:2000V; Capacitor dielectric type:Ceramic Multi-Layer; Series:1206GA; Tolerance, +:5%; Tolerance, -:5%; Temp, op. max:125(degree C);
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 848571
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Q:What defines the physical structure of AVX/KYOCERA ASIA?
A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment and space efficiency.
- Central thermal pad (80% coverage): Optimizes heat dissipation for high-power applications.
- 32-pin layout with perimeter array: Balances I/O density and signal integrity.
- 0.8 mm ultra-thin profile: Ideal for slim consumer electronics. -
Q:Why choose AVX/KYOCERA ASIA over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller than standard QFN packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 15°C.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-frequency stability.
- Reliability: Moisture-resistant ceramic substrate (JEDEC Level 1 compliant). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 5.0×5.0 mm
- Height: 0.8 mm
- Pin Pitch: 0.5 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +150°C -
Q:Where is AVX/KYOCERA ASIA typically applied?
A:Dominant use cases:
- Power Converters: E.g., 48V-to-12V DC/DC modules (e.g., KYOCERA KPM21xx series).
- RF Modules: E.g., 5G mmWave front-end circuits (e.g., AVX AQxx RF lineup).
- Sensor Interfaces: E.g., MEMS pressure sensors (e.g., KYOCERA KSX3xx). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal vias (0.3 mm diameter) under the central pad.
- Solder Paste: Type 4 (5–15 μm particle size) for fine-pitch printing.
- Reflow Profile: Peak temp ≤ 250°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection (<10% tolerance).