AMP PRODUCTS
- Picture & Models
- Description
- Unite Price
- Quantity
- Operation
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MTA, CST-100 II, MT-6 and SL Connectors and Headers; 03P MTA156 HDR ASSY FL ST 30AU ( AMP ),Header FRCTN LK HDR STR 3P Square post gold
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10000
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Splices - Open Barrel; SPLICE AMVAR 3000-7000 020TPBR ( AMP ),Terminals SPLICE AMYAR 3K-7K
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 86000
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Pins and Receptacles; RT ANG SHPL REC 20-16 016BR ( AMP ),Terminals N/I-RCPT 20-16 TYPE A
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 40000
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Post Shunts; AMP SHUNT ASS'Y ( AMP ),Headers & Wire Housings SHUNT .100 02P BLK SN HNDL
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 45449
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T90S1D42-24- 30A 1 form A PCB Mount General Purpose Industrial Relay
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 385637
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T77 Series 10 A SPST (1 Form A) 24 VDC Miniature General Purpose Power Relay
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 384087
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Low Power Sealed Lighting Connectors; Assembly, Receptacle, 3-Position ( Tyco Electronics ),Lighting Connectors Assembly Receptacle 3-Pos
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 33
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2058943-5 Series 6 Position Single Row Inverted SMT Thru Board Connector
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1728
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4.2mm & 4.4mm, 600 V, Dual Action Receptacle Contact ( AMP-DUAC, AMP-DUAC/PL & AMP-DUAC/UPC ); 04P DUAC 94V0 W0/PEG WO/DH LF ( AMP ),Header 04P DUAC 94V0 W0/PEG WO/DH LF
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 50000
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VAL-U-LOK Series Connector System; 10P PM PLUG VAL-U-LOK V0 ( AMP )
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 10500
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VAL-U-LOK Series Connector System; 10P FH PLUG VAL-U-LOK V2 ( AMP )
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 2000
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HTS Connectors and Accessories; HA.3.STI.S ( HTS )
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 1320
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Pin and Pinless Headers (AMP-LATCH); 060 UNIV HDR RA 4S 30DP STD ( AMP ),Header 060 UNIV HDR RA 4S 3
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1 + 10 + 25 + 50 + >=100 -
Minimum : 1 In-stock : 270
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Q:What defines the physical structure of AMP PRODUCTS?
A:Key features include:
- Leadless bottom-mounted pads: Ensures stable PCB attachment.
- Central thermal pad (80% coverage): Optimizes heat dissipation.
- 32-pin layout with perimeter array: Balanced signal distribution.
- 0.8 mm ultra-thin profile: Ideal for space-constrained designs. -
Q:Why choose AMP PRODUCTS over alternatives?
A:Critical advantages:
- Miniaturization: 40% smaller than SOP-8 packages.
- Thermal Performance: Direct PCB heat path reduces junction temperature by 25%.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-frequency stability.
- Reliability: Moisture-resistant substrate (MSL3 rated). -
Q:What are common technical specs?
A:Standard configurations (consult datasheets):
- Body Size: 5.0 × 5.0 mm
- Height: 0.8 mm
- Pin Pitch: 0.5 mm
- Material: Copper-alloy leads with Ni/Pd/Au plating
- Temp Range: -40°C to +125°C -
Q:Where is AMP PRODUCTS typically applied?
A:Dominant use cases:
- Power Converters: E.g., Buck/boost ICs (e.g., TPS62130).
- RF Modules: E.g., Bluetooth/Wi-Fi transceivers (e.g., CC2652R).
- Sensor Interfaces: E.g., MEMS accelerometers (e.g., LIS2DH12). -
Q:What are critical assembly guidelines?
A:Key recommendations:
- PCB Design: 4×4 thermal vias under pad (0.3 mm diameter).
- Solder Paste: Type 4 solder recommended for fine-pitch reliability.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection.



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