96 BGA

Q:What defines the physical structure of 96 BGA?

A:Key features include:
- Leadless bottom-mounted pads: Ensures robust PCB attachment.
- Central thermal pad (80% coverage): Enhances heat dissipation.
- 96-pin layout with 8×12 array: Optimizes pin density and routing.
- 1.2 mm ultra-thin profile: Ideal for space-constrained designs.

Q:Why choose 96 BGA over alternatives?

A:Critical advantages:
- Miniaturization: 40% smaller than equivalent QFP packages.
- Thermal Performance: Direct PCB heat path via thermal pad reduces junction temperature by 15°C.
- Electrical Benefits: Low-inductance design (<0.5 nH) for high-speed signals.
- Reliability: Moisture-resistant substrate (MSL3 certified).

Q:What are common technical specs?

A:Standard configurations (consult datasheets):
- Body Size: 10×10 mm
- Height: 1.2 mm
- Pin Pitch: 0.8 mm
- Material: Copper-alloy pads with FR-4 substrate
- Temp Range: -40°C to +125°C

Q:Where is 96 BGA typically applied?

A:Dominant use cases:
- Power Converters: e.g., Buck/boost ICs (e.g., TI TPS62130).
- RF Modules: e.g., Bluetooth/Wi-Fi SoCs (e.g., Nordic nRF52).
- Sensor Interfaces: e.g., MEMS accelerometers (e.g., ST LIS2DH).

Q:What are critical assembly guidelines?

A:Key recommendations:
- PCB Design: Thermal vias (4×4 array) under central pad.
- Solder Paste: Type 4 solder recommended for fine-pitch reliability.
- Reflow Profile: Peak temp ≤ 245°C (Pb-free process).
- Inspection: X-ray (AXI) mandatory for void detection.